发明申请
- 专利标题: Wiring board
- 专利标题(中): 接线板
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申请号: US11410195申请日: 2006-04-25
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公开(公告)号: US20070095565A1公开(公告)日: 2007-05-03
- 发明人: Makoto Nagai , Hisashi Wakako , Atsushi Uchida , Masahito Morita
- 申请人: Makoto Nagai , Hisashi Wakako , Atsushi Uchida , Masahito Morita
- 专利权人: NGK SPARK PLUG CO., LTD.
- 当前专利权人: NGK SPARK PLUG CO., LTD.
- 优先权: JPP.2005-127012 20050425
- 主分类号: H05K1/11
- IPC分类号: H05K1/11 ; H01L29/04 ; H01R12/04
摘要:
A wiring board (1, 1a, 20, 20a) having: a board body (2, 22) including an insulating material and having a front surface (3, 23), a back surface (4, 24), a cavity (5, 25) having an opening in the front surface (3, 23) of the board body (2, 22) and having a bottom surface (6, 26) and a side surface (7, 27), and a projection which is provided on a front surface side of the side surface (7, 27) of the cavity and projects toward a center of the opening; a metal layer (11) provided on the side surface (7, 27) of the cavity; and an insulating portion which is provided on a back surface (9, 29) of the projection (8, 28) so as to define an obtuse angle (θ) with the metal layer (11), or which covers at least a top end portion of the metal layer (11).
公开/授权文献
- US07700885B2 Wiring board 公开/授权日:2010-04-20
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