Invention Application
- Patent Title: Fabricating inorganic-on-organic interfaces for molecular electronics employing a titanium coordination complex and thiophene self-assembled monolayers
- Patent Title (中): 使用钛配位络合物和噻吩自组装单层制备分子电子学无机界面
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Application No.: US11454538Application Date: 2006-06-16
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Publication No.: US20070098902A1Publication Date: 2007-05-03
- Inventor: James Engstrom , Andrew Chadeayne , Peter Wolczanski , Abhishek Dube , Manish Sharma
- Applicant: James Engstrom , Andrew Chadeayne , Peter Wolczanski , Abhishek Dube , Manish Sharma
- Applicant Address: US NY Ithaca
- Assignee: Cornell Research Foundation, Inc.
- Current Assignee: Cornell Research Foundation, Inc.
- Current Assignee Address: US NY Ithaca
- Main IPC: B05D3/10
- IPC: B05D3/10

Abstract:
Systems and methods for preparing inorganic-organic interfaces using transition metal coordination complexes and self-assembled monolayers as organic surfaces. In one embodiment, a silicon wafer supports a polycrystalline gold layer, optionally using an intermediate adhesionlayer such as Cr. The surface is reacted with the thiophene end of organic molecular species comprising a thiophene moiety to prepare self assembling monomers (SAMs). The functionalized end of the SAM is then reacted with metal-bearing species such as tetrakis(dimethylamido)titanium, Ti[N(CH3)2]4, (TDMAT) to provide a titanium nitride layer.
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