Invention Application
US20070098902A1 Fabricating inorganic-on-organic interfaces for molecular electronics employing a titanium coordination complex and thiophene self-assembled monolayers 审中-公开
使用钛配位络合物和噻吩自组装单层制备分子电子学无机界面

Fabricating inorganic-on-organic interfaces for molecular electronics employing a titanium coordination complex and thiophene self-assembled monolayers
Abstract:
Systems and methods for preparing inorganic-organic interfaces using transition metal coordination complexes and self-assembled monolayers as organic surfaces. In one embodiment, a silicon wafer supports a polycrystalline gold layer, optionally using an intermediate adhesionlayer such as Cr. The surface is reacted with the thiophene end of organic molecular species comprising a thiophene moiety to prepare self assembling monomers (SAMs). The functionalized end of the SAM is then reacted with metal-bearing species such as tetrakis(dimethylamido)titanium, Ti[N(CH3)2]4, (TDMAT) to provide a titanium nitride layer.
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