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发明申请
US20070099009A1 Resin composition for sealing optical device, cured product thereof, and method of sealing semiconductor element 有权
用于密封光学元件的树脂组合物，其固化产物，以及密封半导体元件的方法

Resin composition for sealing optical device, cured product thereof, and method of sealing semiconductor element
摘要：
The present invention provides a composition for sealing optical devices that can form a coating film that exhibits excellent levels of heat resistance, ultraviolet light resistance, optical transparency, toughness and adhesion, and also provides a cured product of the composition, and a sealing method that uses the composition. A resin composition for sealing an optical device, comprising: (i) a silylated organopolysiloxane with a polystyrene equivalent weight average molecular weight of 5×104 or greater, represented by an average composition formula: R1a(OX)bSiO(4−a−b)/2 (wherein, R1 represents an alkyl group, alkenyl group, or aryl group; X represents a combination of a group represented by a formula —SiR2R3R4 (wherein, R2 to R4 are monovalent hydrocarbon groups), and an alkyl group, alkenyl group, alkoxyalkyl group or acyl group; a represents a number within a range from 1.00 to 1.5; b represents a number that satisfies 0
摘要（中）：

本发明提供了一种用于密封光学器件的组合物，该组合物可以形成具有优异的耐热性，耐紫外光性，光学透明性，韧性和粘附性的涂膜，并且还提供了该组合物的固化产物，以及密封方法 使用组合。 一种用于密封光学器件的树脂组合物，其包含：（i）聚苯乙烯换算的重均分子量为5×10 4或更大的甲硅烷基化有机聚硅氧烷，其平均组成式为： -formulae description =“In-line Formulas”end =“lead”？> R＆lt; 1＆lt;＆lt;＆gt;（OX）b 4-ab）/ 2 <？in-line-formula description =“In-line Formulas”end =“tail”？>（其中，R 1表示烷基，烯基 基团或芳基; X表示由下式表示的基团的组合：R 1，R 2，R 3，R 4， O 2〜R 4为一价烃基），烷基，烯基，烷氧基烷基或酰基; a表示1.00〜1.5的数; b 表示满足0

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