Invention Application
- Patent Title: Method and Apparatus for Coating of Substrates
- Patent Title (中): 基材涂层方法及装置
-
Application No.: US11539443Application Date: 2006-10-06
-
Publication No.: US20070101933A1Publication Date: 2007-05-10
- Inventor: Ralph Chappa
- Applicant: Ralph Chappa
- Applicant Address: US MN Eden Prairie 55344-3523
- Assignee: SurModics, Inc.
- Current Assignee: SurModics, Inc.
- Current Assignee Address: US MN Eden Prairie 55344-3523
- Main IPC: B05B5/025
- IPC: B05B5/025

Abstract:
The invention relates to methods and apparatuses that reduce problems encountered during coating of a device, such as a medical device having a cylindrical shape. In an embodiment, the invention includes an apparatus including a bidirectional rotation member. In an embodiment, the invention includes a method with a bidirectional indexing movement. In an embodiment, the invention includes a coating solution supply member having a major axis oriented parallel to a gap between rollers on a coating apparatus. In an embodiment, the invention includes a device retaining member. In an embodiment, the invention includes an air nozzle or an air knife. In an embodiment, the invention includes a method including removing a static charge from a small diameter medical device.
Public/Granted literature
- US07669548B2 Method and apparatus for coating of substrates Public/Granted day:2010-03-02
Information query