A coupling substrate for semiconductor components includes a patterned metal layer on a topside of an insulating carrier. Metal tracks project beyond the insulating carrier, the metal tracks being angled away at the lateral edges of the carrier in the direction of the underside of the carrier and projecting beyond the underside of the carrier. The metal tracks have a metal coating, thereby enlarging each cross section such that the metal tracks form dimensionally stable, flat, conductor external contacts of the coupling substrate.