Invention Application
US20070105037A1 Thick film photoresist composition and method of forming resist pattern
有权
厚膜光致抗蚀剂组合物和形成抗蚀剂图案的方法
- Patent Title: Thick film photoresist composition and method of forming resist pattern
- Patent Title (中): 厚膜光致抗蚀剂组合物和形成抗蚀剂图案的方法
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Application No.: US10578398Application Date: 2004-11-18
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Publication No.: US20070105037A1Publication Date: 2007-05-10
- Inventor: Yasushi Washio , Koji Saito
- Applicant: Yasushi Washio , Koji Saito
- Applicant Address: JP Kanagawa 211-0012
- Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee: TOKYO OHKA KOGYO CO., LTD.
- Current Assignee Address: JP Kanagawa 211-0012
- Priority: JP2003-401563 20031201; JP2004-265693 20040913
- International Application: PCT/JP04/17534 WO 20041118
- Main IPC: G03C1/00
- IPC: G03C1/00
Abstract:
A negative thick film photoresist composition with improved alkali developability is provided. The composition comprises: (A) a resin component containing (a) from 61 to 90% by weight of a structural unit derived from a cyclic alkyl (meth)acrylate ester, and (b) a structural unit derived from a radical polymerizable compound containing a hydroxyl group, (B) a polymerizable compound containing at least one ethylenic unsaturated double bond, (C) a photopolymerization initiator, and (D) an organic solvent.
Public/Granted literature
- US07598014B2 Thick film photoresist composition and method of forming resist pattern Public/Granted day:2009-10-06
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