发明申请
- 专利标题: Systems and methods for thermal management
- 专利标题(中): 热管理系统和方法
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申请号: US11271460申请日: 2005-11-10
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公开(公告)号: US20070106428A1公开(公告)日: 2007-05-10
- 发明人: Takashi Omizo , Charles Johns , Michael Wang , Kazuaki Yazawa , Toshiyuki Hiroi
- 申请人: Takashi Omizo , Charles Johns , Michael Wang , Kazuaki Yazawa , Toshiyuki Hiroi
- 专利权人: Toshiba America Electronic Components
- 当前专利权人: Toshiba America Electronic Components
- 主分类号: G05D23/00
- IPC分类号: G05D23/00
摘要:
Systems and methods for sensing temperatures of multiple functional blocks within a digital device and controlling the operation of these functional blocks in a manner that selectively reduces temperatures associated with some of the functional blocks, but not others. One embodiment comprises an integrated circuit having multiple functional blocks (such as processor cores) and a set of thermal sensors coupled to sense the temperatures of the functional blocks. The integrated circuit includes control circuitry configured to receive signals from the thermal sensors, detect thermal events in the functional blocks and to individually adjust operation of the functional blocks to reduce the temperatures causing the thermal events. In one embodiment, the control circuitry includes a detection/control circuit coupled to each of the functional blocks and a thermal management unit configured to evaluate detected thermal events and to determine actions to be taken in response to the thermal events.
公开/授权文献
- US07349762B2 Systems and methods for thermal management 公开/授权日:2008-03-25
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