Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US11552359Application Date: 2006-10-24
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Publication No.: US20070108516A1Publication Date: 2007-05-17
- Inventor: Sung-Sam LEE , Yong-Tae KIM , Mi-Youn KIM , Gyo-Young JIN , Dae-Won HA , Yun-Gi KIM
- Applicant: Sung-Sam LEE , Yong-Tae KIM , Mi-Youn KIM , Gyo-Young JIN , Dae-Won HA , Yun-Gi KIM
- Applicant Address: KR Gyeonggid-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggid-do
- Priority: KR2005-109140 20051115
- Main IPC: H01L29/94
- IPC: H01L29/94

Abstract:
A semiconductor device capable of suppressing void migration is provided. The semiconductor device includes a dummy region extending in a first direction substantially perpendicular to a second direction in which a word line extends. In addition, an isolation layer pattern may not cut the dummy region in the second direction. Consequently, leaning of the dummy region and void migration are prevented. A method of fabricating the semiconductor device is also provided.
Public/Granted literature
- US07297596B2 Method of manufacturing a semiconductor device having a switching function Public/Granted day:2007-11-20
Information query
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