Semiconductor chip package with a metal substrate and semiconductor module having the same

Invention Application

US20070108599A1 Semiconductor chip package with a metal substrate and semiconductor module having the same 审中-公开

Title translation: 具有金属基板和半导体模块的半导体芯片封装具有相同的功能

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Patent Title: Semiconductor chip package with a metal substrate and semiconductor module having the same
Patent Title (中): 具有金属基板和半导体模块的半导体芯片封装具有相同的功能
Application No.: US11477547

Application Date: 2006-06-30
Publication No.: US20070108599A1

Publication Date: 2007-05-17
Inventor: Yun-Hyeok Im , Jae-Wook Yoo
Applicant: Yun-Hyeok Im , Jae-Wook Yoo
Assignee: Samsung Electronics Co., Ltd.
Current Assignee: Samsung Electronics Co., Ltd.
Priority: KR2005-109178 20051115
Main IPC: H01L23/34
IPC: H01L23/34

Semiconductor chip package with a metal substrate and semiconductor module having the same

Abstract:

A semiconductor chip package includes: a metal substrate having a core; a semiconductor chip mounted on the metal substrate; and a heat sink extending from the core.

Abstract(Chinese):

半导体芯片封装包括：具有芯的金属基板; 安装在所述金属基板上的半导体芯片; 以及从芯延伸的散热片。

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L23/00	半导体或其他固态器件的零部件（H01L25/00优先）
H01L23/34	.冷却装置；加热装置；通风装置或温度补偿装置