发明申请
- 专利标题： Substrate assembly, method of testing the substrate assembly, electrooptical device, method of manufacturing the electrooptical device, and electronic equipment
- 专利标题（中）： 基板组件，基板组件测试方法，电光装置，电光装置的制造方法和电子设备
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申请号： US11651548申请日： 2007-01-10
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公开(公告)号： US20070109485A1公开(公告)日： 2007-05-17
- 发明人: Tsukasa Eguchi , Shinsuke Fujikawa , Tokuro Ozawa
- 申请人： Tsukasa Eguchi , Shinsuke Fujikawa , Tokuro Ozawa
- 申请人地址： JP Tokyo
- 专利权人： Seiko Epson Corporation
- 当前专利权人： Seiko Epson Corporation
- 当前专利权人地址： JP Tokyo
- 优先权： JP2001-179101 20010613; JP2001-179042 20010613; JP2002-122815 20020424
- 主分类号： G02F1/1345
- IPC分类号： G02F1/1345
摘要：
The present invention provides a systems and methods to perform an electrical test on a substrate assembly used as a TFT array substrate of a liquid-crystal device without detaching a mounted external IC. The substrate assembly can include a substrate, a peripheral circuit embedded in the substrate, a first wiring arranged on the substrate, and an external IC, mounted on the substrate, and having a first terminal connected to an interconnection portion arranged on the first wiring. The substrate assembly can further include a second wiring which extends from the interconnection portion in such a manner that the second wiring is routed in a portion of the substrate facing the integrated circuit, and a first external circuit connection terminal arranged on the second wiring in a portion of the substrate not facing the integrated circuit. The external IC is thus tested through the external circuit connection terminal.
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