A method of fabricating a printed circuit board having embedded components is disclosed. The method of fabricating a printed circuit board having embedded components according to an embodiment of the present invention comprises stacking a first conductive layer and a second conductive layer on a substrate in order, forming a hole in the second conductive layer and filling with dielectric material, stacking a third conductive layer on the second conductive layer and removing portions to form an upper electrode located on the dielectric material and a pad electrically connected with the first conductive layer, and stacking an insulation layer on the third conductive layer and forming a via hole and an outer layer circuit electrically connected with the upper electrode and the pad, so that it is easy to process the dielectric material to have a uniform thickness, and the capacitor and the resistor can be implemented simultaneously.