公开(公告)号：US08160417B2

公开(公告)日：2012-04-17

申请号：US12155755

申请日：2008-06-09

Applicant: Joon Sung Kim ,  Sang Hoon Kim ,  Jae Hyun Jung ,  Han Seo Cho

Inventor： Joon Sung Kim ,  Sang Hoon Kim ,  Jae Hyun Jung ,  Han Seo Cho

IPC: G02B6/10

CPC classification number: G02B6/1221 ,  G02B2006/1219 ,  H05K1/0274

Abstract: Disclosed herein is a printed circuit board for an optical waveguide, including a base board, and an optical waveguide formed on the base board. The optical waveguide includes a lower clad layer formed on the base board, an insulation layer formed on the lower clad layer and having a core-forming through-hole, a core part formed on a region of the lower clad layer, which is exposed through the through-hole, and an upper clad layer formed in the through-hole and on the insulation layer.

公开(公告)号：US20120030940A1

公开(公告)日：2012-02-09

申请号：US13200920

申请日：2011-10-05

Applicant: Suk-Hyeon Cho ,  Je-Gwang Yoo ,  Byung-Moon Kim ,  Han-Seo Cho

Inventor： Suk-Hyeon Cho ,  Je-Gwang Yoo ,  Byung-Moon Kim ,  Han-Seo Cho

IPC: H05K3/30

CPC classification number: H05K1/185 ,  H01L24/97 ,  H01L31/0203 ,  H01L33/486 ,  H01L33/64 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H05K1/056 ,  H05K1/181 ,  H05K1/186 ,  H05K3/108 ,  H05K2201/0108 ,  H05K2201/0352 ,  H05K2201/09736 ,  H05K2201/10106 ,  H05K2201/10121 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/92247 ,  H01L2224/0401

Abstract: A method of manufacturing an optical component embedded printed circuit board, the method including: stacking a first insulation layer on one side of a metal core; embedding an optical component in a cavity formed in the metal core; stacking a second insulation layer of a transparent material on the other side of the metal core; and forming a circuit pattern on the first insulation layer, the circuit pattern electrically connected with the optical component.

Abstract translation: 一种制造光学部件嵌入式印刷电路板的方法，所述方法包括：在金属芯的一侧上堆叠第一绝缘层; 将光学部件嵌入形成在所述金属芯中的空腔中; 在金属芯的另一侧堆叠透明材料的第二绝缘层; 以及在所述第一绝缘层上形成电路图案，所述电路图案与所述光学部件电连接。

公开(公告)号：US20120005890A1

公开(公告)日：2012-01-12

申请号：US13137754

申请日：2011-09-09

Applicant: Sang Hoon Kim ,  Han Seo Cho ,  Jae Hyun Jung ,  Joon Sung Kim

Inventor： Sang Hoon Kim ,  Han Seo Cho ,  Jae Hyun Jung ,  Joon Sung Kim

IPC: H05K3/36

CPC classification number: G02B6/43 ,  B32B2307/51 ,  B32B2457/08 ,  C07D301/06 ,  G02B6/138 ,  H05K1/0274 ,  H05K1/028 ,  H05K3/281 ,  H05K3/4635 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T156/10

Abstract: A method of manufacturing a printed circuit board for optical waveguides, including: preparing a base substrate; forming an optical waveguide, which includes a lower clad, a core formed on an upper middle of the lower clad, and an upper clad formed on the lower clad to surround an upper surface and a side surface of the core, on an upper middle of the base substrate; disposing a side substrate including a first side substrate that has a through hole, through which the optical waveguide penetrates, provided at the middle thereof and a first circuit pattern formed therein and a second side substrate disposed on the first side substrate on the upper part of the base substrate on which the optical waveguide is formed; disposing an upper substrate on the side substrate on which the through hole is formed; and stacking the side substrate and the upper substrate on the base substrate on which the optical waveguide is formed.

公开(公告)号：US08048324B2

公开(公告)日：2011-11-01

申请号：US12076359

申请日：2008-03-17

Applicant: Han-Seo Cho ,  Je-Gwang Yoo ,  Sang-Hoon Kim ,  Joon-Sung Kim

Inventor： Han-Seo Cho ,  Je-Gwang Yoo ,  Sang-Hoon Kim ,  Joon-Sung Kim

IPC: G02B6/10

CPC classification number: G02B6/43 ,  G02B6/1221 ,  G02B6/136 ,  H01L2224/16225

Abstract: A method of manufacturing an optical waveguide includes: forming a first reflective bump and a second reflective bump, which have inclined surfaces formed on sides opposite to each other and which are disposed with a predetermined distance in-between, on an upper side of a conductive carrier; polishing the surfaces of the first reflective bump and the second reflective bump; forming a core between the first reflective bump and the second reflective bump; stacking an upper cladding over the upper side of the carrier to cover the first reflective bump, the second reflective bump, and the core; removing the carrier; and stacking a lower cladding over a lower side of the upper cladding. Forming reflective bumps on a conductive carrier, and polishing the reflective bumps to form inclined surfaces, can reduce lead time and can provide a high degree of freedom in design.

Abstract translation: 一种制造光波导的方法包括：形成第一反射凸块和第二反射凸块，所述第一反射凸块和第二反射凸块具有形成在彼此相对的侧面上的倾斜表面，并且在其之间设置有预定距离， 载体 抛光第一反射凸块和第二反射凸块的表面; 在所述第一反射凸块和所述第二反射凸块之间形成芯; 在载体的上侧上堆叠上覆层以覆盖第一反射凸块，第二反射凸块和芯; 移除载体; 并且在上部包层的下侧层叠下部包层。 在导电载体上形成反射凸块，并且对反射凸块进行抛光以形成倾斜表面，可以减少交货时间并且可以提供高度的设计自由度。

公开(公告)号：US07991250B2

公开(公告)日：2011-08-02

申请号：US12923143

申请日：2010-09-03

Applicant: Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Jae-Hyun Jung ,  Han-Seo Cho

Inventor： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Jae-Hyun Jung ,  Han-Seo Cho

IPC: G02B6/12

CPC classification number: G02B6/12002 ,  G02B6/13 ,  G02B6/43 ,  H05K1/0274 ,  H05K3/4652 ,  H05K3/4691

Abstract: A printed circuit board including a first optical waveguide having a circuit pattern and a pad buried in one side thereof, a first insulation layer stacked over one side of the first optical waveguide, a first insulating material stacked over the first insulation layer, a first electrical wiring layer stacked over the first insulating material, a second optical waveguide having a circuit pattern and a pad buried in one side thereof, a second insulation layer stacked over one side of the second optical waveguide, a second insulating material stacked over the second insulation layer, a second electrical wiring layer stacked over the second insulating material, an intermediate layer interposed between the other side of the first optical waveguide and the other side of the second optical waveguide such that the first optical waveguide and the second optical waveguide are attached, and a via penetrating the first optical waveguide and the second optical waveguide.

公开(公告)号：US20110168666A1

公开(公告)日：2011-07-14

申请号：US12986767

申请日：2011-01-07

Applicant: Joon-Sung KIM ,  Han-Seo Cho ,  Jae-Hyun Jung ,  Jong-Ha Park ,  Sang-Hoon Kim

Inventor： Joon-Sung KIM ,  Han-Seo Cho ,  Jae-Hyun Jung ,  Jong-Ha Park ,  Sang-Hoon Kim

IPC: H01P11/00 ,  B32B37/02 ,  B32B37/14 ,  B32B38/10

CPC classification number: B32B37/0015 ,  B32B37/02 ,  B32B2457/08 ,  B32B2457/14 ,  G02B6/0065

Abstract: A method of manufacturing an optical waveguide is disclosed. The method in accordance with an embodiment of the present invention includes providing a carrier, fixing a base substrate to the carrier by using a first insulation layer such that the base substrate is directly stacked on the carrier, stacking an optical waveguide layer on at least one of the base substrate and the first insulation layer, and severing the base substrate such that the base substrate and the optical waveguide layer are separated from the carrier. Accordingly, the optical waveguide layer can be formed with a uniform thickness since wrinkles in the base substrate supporting the optical waveguide layer are prevented from forming during the manufacturing process.

Abstract translation: 公开了一种制造光波导的方法。 根据本发明的实施例的方法包括提供载体，通过使用第一绝缘层将基底固定到载体上，使得基底基板直接堆叠在载体上，将光波导层堆叠在至少一个 的基底基板和第一绝缘层，并且切断基底基板，使得基底基板和光波导层与载体分离。 因此，光波导层可以形成均匀的厚度，因为在制造过程中防止了支撑光波导层的基底基板中的皱纹成形。

公开(公告)号：US20110116736A1

公开(公告)日：2011-05-19

申请号：US12760035

申请日：2010-04-14

Applicant: Sang-Hoon KIM ,  Han-Seo Cho ,  Joon-Sung Kim ,  Jae-Hyun Jung

Inventor： Sang-Hoon KIM ,  Han-Seo Cho ,  Joon-Sung Kim ,  Jae-Hyun Jung

IPC: G02B6/12 ,  B05D5/12 ,  B29C65/00

CPC classification number: G02B6/4214 ,  B32B37/02 ,  B32B38/10 ,  B32B2038/0092 ,  B32B2457/08 ,  B32B2457/14 ,  G02B6/428 ,  G02B6/43 ,  Y10T156/1002

Abstract: An optical wiring board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the method includes providing a base substrate having an optical waveguide layer with a mirror groove formed on one surface thereof and a first insulation layer stacked on one surface of the optical waveguide layer and having a through-hole connected with the mirror groove formed thereon, forming a metal mirror layer connected from the mirror groove to an inner wall of the through-hole and forming an electrode pad on a side of the other surface of the optical waveguide layer, in which the electrode pad is disposed in accordance with the position of the metal mirror layer.

Abstract translation: 公开了一种光布线板及其制造方法。 根据本发明的实施例，该方法包括提供一基底基板，该基底基板具有光波导层，该光波导层在其一个表面上形成有反射镜槽，第一绝缘层堆叠在该光波导层的一个表面上， 与形成在其上的反射镜槽连接的孔，形成从反射镜槽连接到通孔的内壁的金属镜层，并在光波导层的另一个表面的一侧形成电极焊盘，其中电极 按照金属镜面层的位置设置衬垫。

公开(公告)号：US20110019959A1

公开(公告)日：2011-01-27

申请号：US12588453

申请日：2009-10-15

Applicant: Sang Hoon Kim ,  Han Seo Cho ,  Jae Hyun Jung ,  Joon Sung Kim

Inventor： Sang Hoon Kim ,  Han Seo Cho ,  Jae Hyun Jung ,  Joon Sung Kim

IPC: G02B6/12 ,  B29C65/48 ,  H05K3/36

CPC classification number: G02B6/43 ,  B32B2307/51 ,  B32B2457/08 ,  C07D301/06 ,  G02B6/138 ,  H05K1/0274 ,  H05K1/028 ,  H05K3/281 ,  H05K3/4635 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T156/10

Abstract: The present invention relates to a printed circuit board for optical waveguides and a method of manufacturing the same. The present invention provides a printed circuit board for optical waveguides includes: a base substrate; an optical waveguide that is formed on an upper middle of the base substrate and includes a lower clad, a core formed on an upper middle of the lower clad, and an upper clad formed on the lower clad to surround an upper surface and a side surface of the core; and a side substrate that is formed on the base substrate and has a through hole, through which the optical waveguide penetrates, provided at the middle thereof and a circuit pattern formed therein and a method of manufacturing a printed circuit board for optical waveguides.

Abstract translation: 本发明涉及一种用于光波导的印刷电路板及其制造方法。 本发明提供了一种用于光波导的印刷电路板，包括：基底; 光波导，其形成在所述基底基板的上部中间并且包括下部包层，形成在所述下部包层的上部中间的芯部，以及形成在所述下部包层上的上部包层，以包围上表面和侧面 的核心; 以及侧基板，其形成在基底基板上，并且具有通孔，光波导穿过该通孔设置在其中间，形成在其中的电路图案以及制造用于光波导的印刷电路板的方法。

公开(公告)号：US07809220B2

公开(公告)日：2010-10-05

申请号：US12219135

申请日：2008-07-16

Applicant: Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Jae-Hyun Jung ,  Han-Seo Cho

Inventor： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Jae-Hyun Jung ,  Han-Seo Cho

IPC: G02B6/12

CPC classification number: G02B6/12002 ,  G02B6/13 ,  G02B6/43 ,  H05K1/0274 ,  H05K3/4652 ,  H05K3/4691

Abstract: A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The printed circuit board can include: an optical waveguide, in one side of which a circuit pattern and a pad are buried; an insulation layer stacked over one side of the optical waveguide; a first insulating material stacked over the insulation layer; a first electrical wiring layer stacked over the first insulating material; a second insulating material stacked over the other side of the optical waveguide; a second electrical wiring layer stacked over the second insulating material; and a via penetrating the optical waveguide. Certain embodiments of the invention enable the efficient transmission of optical and electrical signals, reduce loss in the optical signals transferred to the photoelectric converters, and allow more efficient designs for the wiring in the board.

Abstract translation: 公开了印刷电路板和印刷电路板的制造方法。 印刷电路板可以包括：光波导，其一侧埋有电路图案和垫; 层叠在光波导一侧的绝缘层; 堆叠在所述绝缘层上的第一绝缘材料; 堆叠在所述第一绝缘材料上的第一电布线层; 层叠在所述光波导的另一侧的第二绝缘材料; 层叠在所述第二绝缘材料上的第二电布线层; 以及穿过光波导的通孔。 本发明的某些实施例能够有效地传输光信号和电信号，减少传输到光电转换器的光信号的损耗，并且允许更有效的设计用于电路板中的配线。

公开(公告)号：US20090103860A1

公开(公告)日：2009-04-23

申请号：US12314449

申请日：2008-12-10

Applicant: Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Han Seo Cho

Inventor： Sang-Hoon Kim ,  Je-Gwang Yoo ,  Joon-Sung Kim ,  Han Seo Cho

IPC: G02B6/12

CPC classification number: G02B6/43 ,  G02B6/4214 ,  H05K1/0274 ,  H05K3/4691 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A printed circuit board is disclosed. A printed circuit board, which includes a first board part, a flexible board part which has one side coupled with the first board part and which includes an electrical wiring layer and an optical waveguide to transmit both electrical signals and optical signals, and a second board part coupled with the other side of the flexible board part, where the electrical wiring layer and the optical waveguide are disposed with a gap in-between, can provide greater bendability and reliability, by having the optical waveguide and electrical wiring layer separated with a gap in-between at the flexible portion of the board, and the optical waveguide can be manufactured with greater precision for even higher reliability, by having the optical waveguide manufactured separately and then inserted during the manufacturing process of the board.

Abstract translation: 公开了印刷电路板。 一种印刷电路板，包括第一板部分，柔性板部分，其一侧与第一板部分耦合并且包括电布线层和光波导以传输电信号和光信号;以及第二板 与柔性基板部分的另一侧耦合的部分，其中电布线层和光波导在其间具有间隙设置，可以通过使光波导和电布线层间隔开来提供更大的弯曲性和可靠性 在板的柔性部分之间，通过使光波导分别制造，然后在板的制造过程中插入，可以以更高的精度制造光波导以获得更高的可靠性。