Invention Application
- Patent Title: PROCESS FOR FORMING A REDUNDANT STRUCTURE
- Patent Title (中): 形成冗余结构的过程
-
Application No.: US11164223Application Date: 2005-11-15
-
Publication No.: US20070111497A1Publication Date: 2007-05-17
- Inventor: Birendra Agarwala , Du Binh Nguyen , Hazara Rathore
- Applicant: Birendra Agarwala , Du Binh Nguyen , Hazara Rathore
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/4763
Abstract:
Device and method of fabricating device. The device includes a dual damascene line having a metal line and a via, and a redundant liner arranged to divide the metal line. The method includes forming a trench in a metal stripe of a dual damascene line, depositing a barrier layer in the trench, and filling a remainder of the trench with metal.
Public/Granted literature
- US07279411B2 Process for forming a redundant structure Public/Granted day:2007-10-09
Information query
IPC分类:
