Invention Application
US20070111587A1 Method for forming a connector assembly for use with an implantable medical device
有权
用于形成用于可植入医疗装置的连接器组件的方法
- Patent Title: Method for forming a connector assembly for use with an implantable medical device
- Patent Title (中): 用于形成用于可植入医疗装置的连接器组件的方法
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Application No.: US11281008Application Date: 2005-11-17
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Publication No.: US20070111587A1Publication Date: 2007-05-17
- Inventor: Andrew Ries , Jay Lahti , George Patras , John Longtin , Bryan Zart
- Applicant: Andrew Ries , Jay Lahti , George Patras , John Longtin , Bryan Zart
- Main IPC: H01R4/24
- IPC: H01R4/24
Abstract:
A sectional interconnect ribbon for use in a connector assembly for an implantable medical device is formed of two ore more separately-formed sections which are mechanically joined together to form an integral assembly. The sectional interconnect ribbon, as well as at least one connection element, is embedded within the connector assembly.
Public/Granted literature
- US07413482B2 Method for forming a connector assembly for use with an implantable medical device Public/Granted day:2008-08-19
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