公开(公告)号：US20070293099A1

公开(公告)日：2007-12-20

申请号：US11842704

申请日：2007-08-21

Applicant: Bryan Zart ,  Brian Burwick ,  Andrew Ries ,  John Nicholson ,  Jay Lahti ,  Gregory Theis

Inventor： Bryan Zart ,  Brian Burwick ,  Andrew Ries ,  John Nicholson ,  Jay Lahti ,  Gregory Theis

IPC: H01R13/405 ,  H05K3/30

CPC classification number: H01R43/24 ,  A61N1/05 ,  A61N1/3752 ,  H01R13/405 ,  H01R13/504 ,  H01R43/18 ,  H05K1/0284 ,  H05K3/202 ,  Y10S439/905 ,  Y10T29/49146 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4922

Abstract: A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.

Abstract translation: 用于可植入医疗装置的连接器电路组件，以及使用注射成型工艺或机械加工工艺制造包括由热塑性材料形成的芯部的组件的方法。 该芯部分适于安装至少一个导电电路部件，例如连接器部件，固定螺丝块或导电跳线部件。 在本发明的一个实施例中，芯部分包括适于装载各种电路部件的多个插座或其它空间。 芯组件被定位成二次模具组件，并且将第二热塑性材料注入到模具中，使得第二热塑性材料延伸并粘附到芯部分和电路部件上。

公开(公告)号：US20070190866A1

公开(公告)日：2007-08-16

申请号：US11668260

申请日：2007-01-29

Applicant: Bryan Zart ,  Andrew Ries ,  Brian Burwick ,  John Nicholson ,  Jay Lahti ,  Gregory Theis

Inventor： Bryan Zart ,  Andrew Ries ,  Brian Burwick ,  John Nicholson ,  Jay Lahti ,  Gregory Theis

IPC: H01R13/405

CPC classification number: H01R13/405 ,  A61N1/05 ,  A61N1/37229 ,  A61N1/3752 ,  H01R43/24 ,  Y10S439/909

Abstract: A connector assembly for coupling to an implantable medical device includes a core element formed of a first thermoplastic material shaped to receive a connector member for receiving a lead. The connector assembly further includes a circuit member positioned adjacent to the core element. The circuit member includes a portion extending along the core element to the connector member and an antenna structure extending over a portion of the core element outer surface.

Abstract translation: 用于联接到可植入医疗装置的连接器组件包括由第一热塑性材料形成的芯元件，该第一热塑性材料成形为接收用于接收引线的连接器构件。 连接器组件还包括邻近核心元件定位的电路元件。 电路构件包括沿芯体延伸到连接器构件的部分和在芯体元件外表面的一部分上延伸的天线结构。

公开(公告)号：US20070100386A1

公开(公告)日：2007-05-03

申请号：US11263526

申请日：2005-10-31

Applicant: Carole Tronnes ,  Robert Munoz ,  Alexander Lakanu ,  John Swoyer ,  Greg Theis ,  Bryan Zart ,  David DeSmet

Inventor： Carole Tronnes ,  Robert Munoz ,  Alexander Lakanu ,  John Swoyer ,  Greg Theis ,  Bryan Zart ,  David DeSmet

IPC: A61N1/00

CPC classification number: A61N1/3752 ,  Y10T29/49208

Abstract: The disclosure describes an axial lead connector assembly for an implantable medical device (IMD). The lead connector assembly facilitates electrical connection between an implantable medical lead and circuitry contained within the housing of an IMD. A connector header defines an axial stack bore to receive an axial stack of in-line connector components. The connector components define a common lead bore to receive a proximal end of an implantable lead. The in-line stack of connector components may include seals, electrical connector elements, a strain relief, and a locking device, each of which defines a passage that forms part of the lead bore.

Abstract translation: 本公开描述了用于可植入医疗装置（IMD）的轴向引线连接器组件。 导线连接器组件有助于可植入医疗引线和包含在IMD的壳体内的电路之间的电连接。 连接器插头限定轴向堆叠孔以接收轴向堆叠的在线连接器部件。 连接器部件限定了用于接收可植入引线的近端的公共引线孔。 连接器部件的直列堆叠可以包括密封件，电连接器元件，应变消除件和锁定装置，每个锁定装置限定形成引导孔的一部分的通道。

公开(公告)号：US20050137642A1

公开(公告)日：2005-06-23

申请号：US10966636

申请日：2004-10-15

Applicant: Bryan Zart ,  Brian Burwick ,  Andrew Ries ,  John Nicholson ,  Jay Lahti ,  Gregory Theis

Inventor： Bryan Zart ,  Brian Burwick ,  Andrew Ries ,  John Nicholson ,  Jay Lahti ,  Gregory Theis

IPC: A61N1/375 ,  H01R13/504 ,  H01R43/18

CPC classification number: H01R13/504 ,  A61N1/3752 ,  H01R43/18 ,  Y10T29/49146

Abstract: An improved circuit assembly for use in an implantable medical device, and a method of making the assembly is disclosed. The circuit assembly includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. Core portion may further be provided with groove and ridge members designed to position and retain the circuit components at predetermined locations around the various surfaces of the core portion. One or more of the circuit components may be welded or soldered together to form electrical contacts. Next, this loaded core assembly is prepared for an overmolding process by loading bushings into apertures of the various conductive circuit components to prevent these apertures from receiving thermoplastic material during the overmold process. The prepared and loaded core assembly is positioned into a second-shot mold assembly, and a second-shot of thermoplastic material is injected into the mold. This thermoplastic material is heated to a temperature at, or above, the melting point of the material to create a bond between the core portion and the overmold material. To achieve this, the ratio of the mass of the core element as compared to that of the overmold material is made as small as possible so that the heat energy from the mold is able to adequately heat the core portion. Bonding may further be enhanced by providing ridges on the surface of the core portion that are melted during the overmold process, and/or by pre-heating the core portion prior to injecting the second shot of thermoplastic material into the mold.

公开(公告)号：US20070255156A1

公开(公告)日：2007-11-01

申请号：US11380773

申请日：2006-04-28

Applicant: John Mertz ,  Bryan Zart ,  James Strom ,  Michael Fletcher ,  John Nicholson ,  Steven Fischer

Inventor： John Mertz ,  Bryan Zart ,  James Strom ,  Michael Fletcher ,  John Nicholson ,  Steven Fischer

IPC: A61B5/02

CPC classification number: A61N1/375 ,  A61B5/0006 ,  A61B5/042 ,  A61B5/0422 ,  A61B5/7207 ,  A61B2562/125 ,  A61N1/0504 ,  A61N1/3756

Abstract: Apparatus and method according to the disclosure relate to minimizing gaps between a substantially planar cardiac-sensing electrode and a shroud member utilizing a so-called interference-fit. For example, a relatively recessed area or aperture formed in an exemplary resin-based shroud member has slightly reduced dimensions relative to the electrode and requires compression forces during assembly (e.g., manually or in an automated process including a press, a tool or other means). The interference-fit promotes a very tight fit (or seal) between the metallic electrode and the resin-based shroud member and, importantly, minimizes gaps. Additionally, discrete interference structures promote fluid tight seals between the electrode and a recess or aperture adapted to receive the electrode.

Abstract translation: 根据本公开的装置和方法涉及使用所谓的干涉配合来最小化基本上平面的心脏感测电极和护罩构件之间的间隙。 例如，形成在示例性基于树脂的护罩构件中的相对凹陷的区域或孔相对于电极具有略微减小的尺寸，并且在组装期间需要压缩力（例如，手动地或以包括压力机，工具或其他装置的自动化过程 ）。 干涉配合促进金属电极和树脂基护罩构件之间非常紧密的配合（或密封），并且重要地使间隙最小化。 此外，离散干涉结构促进电极与适于接收电极的凹部或孔之间的流体密封。

公开(公告)号：US20070111587A1

公开(公告)日：2007-05-17

申请号：US11281008

申请日：2005-11-17

Applicant: Andrew Ries ,  Jay Lahti ,  George Patras ,  John Longtin ,  Bryan Zart

Inventor： Andrew Ries ,  Jay Lahti ,  George Patras ,  John Longtin ,  Bryan Zart

IPC: H01R4/24

CPC classification number: H01R13/504 ,  A61N1/3752 ,  H01R4/02 ,  H01R4/029 ,  H01R4/30 ,  H01R13/03 ,  H01R43/16 ,  H01R43/24 ,  Y10T29/49146

Abstract: A sectional interconnect ribbon for use in a connector assembly for an implantable medical device is formed of two ore more separately-formed sections which are mechanically joined together to form an integral assembly. The sectional interconnect ribbon, as well as at least one connection element, is embedded within the connector assembly.

Abstract translation: 用于可植入医疗装置的连接器组件中的截面互连带由两个更多分开形成的部分形成，这些部分机械连接在一起以形成整体组件。 分段互连带以及至少一个连接元件嵌入连接器组件内。

公开(公告)号：US5851221A

公开(公告)日：1998-12-22

申请号：US905093

申请日：1997-08-01

Applicant: Eric M. Rieder ,  Frank Gonzalez ,  Randal C. Schulhauser ,  Bryan Zart

Inventor： Eric M. Rieder ,  Frank Gonzalez ,  Randal C. Schulhauser ,  Bryan Zart

IPC: A61N1/375

CPC classification number: A61N1/375

Abstract: An implantable medical device of the type formed of a hermetically sealed enclosure attached on a enclosure attachment surface thereof to a module attachment surface of a pre-formed header module is disclosed. The pre-formed header module is attached to the enclosure attachment surface through use of a retention structure extending away from the enclosure surface into proximity with a portion of the pre-formed header module when the enclosure and module attachment surfaces are aligned with respect to one another. The retention structure comprises a bendable member that is bent from an initial position allowing the pre-formed header module to be seated with respect to the hermetically sealed enclosure to a retention position making an attachment against a bend engaging portion of the pre-formed header module. The bendable member is the free end portion of an attachment tab having a tab base attached at a predetermined location of the hermetically sealed enclosure such that the upstanding attachment tab extends in a predetermined direction away from the enclosure surface and the free end of the attachment tab is bendable laterally with respect to the predetermined direction against the bend engaging portion. Adhesive is then applied to the retention mechanism and the space between the enclosure attachment surface and the module attachment surface.

Abstract translation: 公开了一种由安装在其外壳附接表面上的密封外壳形成的可植入式医疗装置，其中预先形成的头部模块的模块附接表面。 当外壳和模块附接表面相对于一个对准时，通过使用延伸远离外壳表面的保持结构与预成型的头部模块的一部分相接合，预形成的头模块附接到外壳附接表面 另一个。 保持结构包括弯曲构件，该弯曲构件从初始位置弯曲，允许预成型的头部模块相对于密封的壳体就座到保持位置，该保持位置抵靠预成型的头部模块的弯曲接合部分 。 可弯曲构件是附接突片的自由端部，其具有附接在密封外壳的预定位置处的突片底座，使得直立的附接突片沿着预定的方向延伸远离封闭表面，并且附接突片的自由端 相对于预定方向横向地弯曲弯曲接合部分。 然后将粘合剂施加到保持机构以及外壳附接表面和模块附接表面之间的空间。

公开(公告)号：US20070087637A1

公开(公告)日：2007-04-19

申请号：US11612278

申请日：2006-12-18

Applicant: Bryan Zart ,  Brian Burwick ,  Andrew Ries ,  John Nicholson ,  Jay Lahti ,  Gregory Theis

Inventor： Bryan Zart ,  Brian Burwick ,  Andrew Ries ,  John Nicholson ,  Jay Lahti ,  Gregory Theis

IPC: H01R13/405

CPC classification number: H01R43/24 ,  A61N1/05 ,  A61N1/3752 ,  H01R13/405 ,  H01R13/504 ,  H01R43/18 ,  H05K1/0284 ,  H05K3/202 ,  Y10S439/905 ,  Y10T29/49146 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4922

Abstract: A connector circuit assembly for use in an implantable medical device, and a method of making the assembly that includes a core portion formed of a thermoplastic material using either an injection molding process or a machining process. This core portion is adapted to be fitted with at least one electrically-conductive circuit component such as a connector member, a set-screw block, or a conductive jumper member. In one embodiment of the invention, the core portion includes multiple receptacles or other spaces that are adapted to be loaded with the various circuit components. The core assembly is positioned into a second-shot mold assembly, and a second thermoplastic material is injected into the mold so that the second thermoplastic material extends over and adheres to the core portion and the circuit component.

公开(公告)号：US20050245982A1

公开(公告)日：2005-11-03

申请号：US10836118

申请日：2004-04-30

Applicant: John Kast ,  Steve Deininger ,  Jeffrey Clayton ,  Bryan Zart ,  Thomas Meyer

Inventor： John Kast ,  Steve Deininger ,  Jeffrey Clayton ,  Bryan Zart ,  Thomas Meyer

IPC: A61N1/375 ,  H01R13/52

CPC classification number: A61N1/3752 ,  H01R13/5216 ,  H01R2201/12

Abstract: A connector block providing electrical coupling to electronic componentry of an implantable medical device. The implantable medical device has a case containing the electronic componentry. A preformed electrically conductive “wireform” mounted with respect to a structurally rigid polymer frame forming a plurality of electrical contacts. Potting is formed in situ with liquid thermoset polymer substantially filling any voids in the connector block and forming a thermoset polymer gasket between the connector block and the case.

Abstract translation: 一种提供与可植入医疗装置的电子组件的电耦合的连接器块。 可植入医疗装置具有包含电子部件的壳体。 相对于形成多个电触点的结构刚性聚合物框架安装的预成型导电“线形”。 在液体热固性聚合物基本上填充连接器块中的任何空隙并且在连接器块和壳体之间形成热固性聚合物垫片的情况下，原位形成灌封。