发明申请
- 专利标题： LAYOUT STRUCTURE OF BALL GRID ARRAY
- 专利标题（中）： 球网阵列布局结构
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申请号： US11309542申请日： 2006-08-18
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公开(公告)号： US20070114578A1公开(公告)日： 2007-05-24
- 发明人: Ya-Ling Huang
- 申请人： Ya-Ling Huang
- 申请人地址： TW Tu-Cheng
- 专利权人： HON HAI PRECISION INDUSTRY CO., LTD.
- 当前专利权人： HON HAI PRECISION INDUSTRY CO., LTD.
- 当前专利权人地址： TW Tu-Cheng
- 优先权： CN200510101741.X 20051124
- 主分类号： H01L29/80
- IPC分类号： H01L29/80
摘要：
A layout structure of ball grid array is provided. The layout structure includes: a substrate having a margin area; a plurality of solder ball pads laid on the substrate; a plurality of interconnection vias each electrically coupled to a corresponding one of the plurality of solder ball pads; and at least one of the plurality of interconnection vias arrayed on the margin area so that no interconnection vias are arrayed between one of the plurality of interconnection vias and an edge of the margin area.
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