公开(公告)号：US20160376839A1

公开(公告)日：2016-12-29

申请号：US15176243

申请日：2016-06-08

Applicant: Ya-Ling Huang

Inventor： Ya-Ling Huang

IPC: E06B9/322 ,  E06B9/323

CPC classification number: E06B9/322 ,  E06B9/262 ,  E06B9/323 ,  E06B2009/2627 ,  E06B2009/3222

Abstract: A cord-winding device for a window blind includes a base unit having a base defining a slide channel. An adjustment unit includes two slide seats mounted in the slide channel and slidable toward or away from each other, two sets of pulleys mounted respectively and rotatably on the slide seats, at least one elastic unit disposed on one of the slide seats, and an adjustment cord winding around the sets of pulleys and then extending through the base. The adjustment cord is configured to be connected to the window blind after extending through the base, and is configured to support the weight of the window blind to thereby generate a pulling force to pull the slide seats.

Abstract translation: 用于窗帘的帘线缠绕装置包括具有限定滑动通道的底座的基座单元。 调节单元包括安装在滑动通道中并可相对于彼此滑动或相互滑动的两个滑动座，分别安装在滑动座上的可旋转的两组滑轮，设置在滑动座之一上的至少一个弹性单元， 绳索缠绕在一组滑轮上，然后延伸穿过底座。 调整线构造成在延伸通过基座后连接到窗帘，并且被配置为支撑窗帘的重量，从而产生拉力以拉动滑座。

公开(公告)号：US08438529B1

公开(公告)日：2013-05-07

申请号：US13585854

申请日：2012-08-15

Applicant: Ya-Ling Huang ,  Ling-Ling Shen ,  Chia-Nan Pai ,  Shou-Kuo Hsu

Inventor： Ya-Ling Huang ,  Ling-Ling Shen ,  Chia-Nan Pai ,  Shou-Kuo Hsu

IPC: G06F17/50

CPC classification number: G06F17/5081

Abstract: A computer-based method and a computing device for checking signal transmission lines of a printed circuit board (PCB) layout are provided. The computing device identifies differential pairs in a currently run PCB layout according to an information file for the currently run PCB layout, checks whether any signal transmission line is routed between switching vias of each differential pair according to the information file for the currently run PCB layout, and displays a routing error window to display information of each misrouted signal transmission line.

Abstract translation: 提供了一种用于检查印刷电路板（PCB）布局的信号传输线的基于计算机的方法和计算装置。 根据当前运行的PCB布局的信息文件，计算设备根据当前运行的PCB布局的信息文件识别当前运行的PCB布局中的差分对，根据当前运行的PCB布局的信息文件，检查每个差分对的切换通孔之间是否有任何信号传输线路由 ，并显示路由错误窗口以显示每条错误路由的信号传输线路的信息。

公开(公告)号：US07498202B2

公开(公告)日：2009-03-03

申请号：US11293992

申请日：2005-12-05

Applicant: Hung-Ta Hsu ,  Tzu-Bin Lin ,  Ya-Ling Huang ,  Ya-Yu Hsieh

Inventor： Hung-Ta Hsu ,  Tzu-Bin Lin ,  Ya-Ling Huang ,  Ya-Yu Hsieh

IPC: H01L21/00

CPC classification number: H01L24/83 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/07025 ,  H01L2924/00

Abstract: A method for die attaching is disclosed. At first, at least one die and a die-attach preform are separately provided. The die-attach preform is picked and placed upon a die carrier. Then, the die is picked and placed upon the die-attach preform. The die and the die carrier are heated and clipped, so that the die-attach preform can adhere the die and the die carrier at the same time.

Abstract translation: 公开了一种贴片方法。 首先，分别提供至少一个模具和模具附接预成型件。 将芯片附着的预型件拾取并放置在模具载体上。 然后，将模具取下并放置在芯片附着的预制件上。 模具和模具载体被加热和夹紧，使得模具附接预成型件可以同时粘附模具和模具载体。

公开(公告)号：US20070114578A1

公开(公告)日：2007-05-24

申请号：US11309542

申请日：2006-08-18

Applicant: Ya-Ling Huang

Inventor： Ya-Ling Huang

IPC: H01L29/80

CPC classification number: H01L23/49838 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/112 ,  H05K2201/093 ,  H05K2201/10734 ,  H01L2924/00

Abstract: A layout structure of ball grid array is provided. The layout structure includes: a substrate having a margin area; a plurality of solder ball pads laid on the substrate; a plurality of interconnection vias each electrically coupled to a corresponding one of the plurality of solder ball pads; and at least one of the plurality of interconnection vias arrayed on the margin area so that no interconnection vias are arrayed between one of the plurality of interconnection vias and an edge of the margin area.

Abstract translation: 提供球栅阵列的布局结构。 布局结构包括：具有边缘区域的基板; 放置在基板上的多个焊球垫; 多个互连通孔，每个互连通孔电耦合到所述多个焊球垫中的对应的一个; 并且所述多个互连通孔中的至少一个布置在所述边缘区域上，使得在所述多个互连通孔中的一个与所述边缘区域的边缘之间不布置互连通孔。

公开(公告)号：US20070074898A1

公开(公告)日：2007-04-05

申请号：US11490400

申请日：2006-07-20

Applicant: Chan-Fei Tai ,  Ya-Ling Huang

Inventor： Chan-Fei Tai ,  Ya-Ling Huang

IPC: H05K1/16

CPC classification number: H05K1/111 ,  H05K1/0295 ,  H05K2201/09954 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A pad is adapted for selectively receiving a first surface mounted component (SMC) and a second SMC on a printed circuit board. The first SMC and the second SMC include a number of footprints respectively. The pad includes a first portion for receiving the first SMC, a second portion for receiving the second SMC. Configurations and sizes of the first portion and the second portion are same with the ones of the footprints of the first SMC and the second SMC respectively. The second portion is overlapped with the first portion. The pad can selectively receive one of the first SMC and the second SMC.

Abstract translation: 衬垫适于选择性地接收印刷电路板上的第一表面安装部件（SMC）和第二SMC。 第一个SMC和第二个SMC分别包括一些脚印。 垫包括用于接收第一SMC的第一部分，用于接收第二SMC的第二部分。 第一部分和第二部分的配置和尺寸分别与第一SMC和第二SMC的占用面积相同。 第二部分与第一部分重叠。 垫可以选择性地接收第一SMC和第二SMC中的一个。

公开(公告)号：US09574393B2

公开(公告)日：2017-02-21

申请号：US14802692

申请日：2015-07-17

Applicant: Ya-Ling Huang

Inventor： Ya-Ling Huang

IPC: E06B9/262 ,  E06B9/322 ,  E06B9/323

CPC classification number: E06B9/262 ,  E06B9/322 ,  E06B9/323 ,  E06B2009/2625 ,  E06B2009/2627 ,  E06B2009/3222

Abstract: A cord-winding device for a blind assembly having no pull cord includes a base seat defining a slide channel and having a bottom side configured to removably mount the blind assembly thereto, and an adjustment unit including a slide seat mounted slidably in the slide channel, a plurality of rollers mounted on the base seat and the slide seat, respectively, and a constant force spring having first and second ends respectively fixed to the base seat and the slide seat. A lift cord winds around the rollers and extends through the base seat. The lift cord is configured to extend through the blind assembly after extending through the base seat so as to be positioned to the base seat and the blind assembly.

Abstract translation: 一种用于没有拉绳的盲组件的帘线缠绕装置包括限定滑动通道的基座，并且具有被配置为可拆卸地将盲组件安装到其上的底侧;以及调节单元，其包括可滑动地安装在滑动通道中的滑动座， 分别安装在基座和滑动座上的多个滚子以及具有分别固定在基座和滑座上的第一和第二端的恒力弹簧。 电梯线绕着滚轮并延伸穿过基座。 提升帘线构造成在延伸通过基座之后延伸通过盲组件，以便定位到基座和盲组件。

公开(公告)号：US07448016B2

公开(公告)日：2008-11-04

申请号：US11472975

申请日：2006-06-21

Applicant: Chan-Fei Tai ,  Ya-Ling Huang

Inventor： Chan-Fei Tai ,  Ya-Ling Huang

IPC: G06F17/50 ,  H05K1/00 ,  H01R12/00

CPC classification number: H05K1/111 ,  H05K1/0295 ,  H05K2201/09381 ,  H05K2201/09954 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A pad layout of a printed circuit board includes a first and a second pad symmetrically arranged on the PCB for cooperatively receiving either a first surface mounted component (SMC) or a second surface mounted component (SMC). Each of the SMCs includes a first footprint and a second footprint. The first pad has a polygonal shape corresponding to a minimum sized shape that accommodates both a shape of the first footprint of the first SMC and a shape of the first footprint of the second SMC. The second pad has a polygonal shape corresponding to a minimum sized shape that accommodates both a shape of the second footprint of the first SMC and a shape of the second footprint of the second SMC.

Abstract translation: 印刷电路板的焊盘布局包括对称地布置在PCB上的第一和第二焊盘，用于协作地接收第一表面安装部件（SMC）或第二表面安装部件（SMC）。 每个SMC包括第一足迹和第二足迹。 第一垫具有对应于最小尺寸形状的多边形形状，其适应第一SMC的第一印迹的形状和第二SMC的第一印迹的形状。 第二垫具有对应于最小尺寸形状的多边形形状，其适应第一SMC的第二印迹的形状和第二SMC的第二印迹的形状。

公开(公告)号：US20050139994A1

公开(公告)日：2005-06-30

申请号：US11023353

申请日：2004-12-29

Applicant: Hung-Ta Hsu ,  Tzu-Bin Lin ,  Ya-Ling Huang

Inventor： Hung-Ta Hsu ,  Tzu-Bin Lin ,  Ya-Ling Huang

IPC: H01L23/31 ,  H01L23/36 ,  H01L23/373 ,  H01L23/34 ,  H01L21/48

CPC classification number: H01L23/3737 ,  H01L23/3128 ,  H01L23/36 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor package includes a die attached to a substrate. Multitudes of conductive structures are conductively connected the die and the substrate. One molding compound encapsulates the die, and thermal interface material is on the molding compound. Next, a heat sink is on the thermal interface material. The mold compound material performs a coefficient of thermal expansion smaller than the heat sink so as to prevent the die or substrate from the damages of internal stresses.

Abstract translation: 半导体封装包括附接到衬底的管芯。 多个导电结构导电地连接管芯和衬底。 一种模塑料封装模具，热界面材料在模塑料上。 接下来，散热器在热界面材料上。 模具复合材料的热膨胀系数小于散热器，以防止模具或衬底损坏内部应力。

公开(公告)号：US08468472B1

公开(公告)日：2013-06-18

申请号：US13456241

申请日：2012-04-26

Applicant: Ya-Ling Huang ,  Chia-Nan Pai ,  Shou-Kuo Hsu

Inventor： Ya-Ling Huang ,  Chia-Nan Pai ,  Shou-Kuo Hsu

IPC: G06F50/17

CPC classification number: G06F17/5081 ,  G06F2217/82

Abstract: In a computing device, computerized method, and a non-transitory storage medium, plug-in capacitors are selected from capacitors in a wiring diagram according pin information of the capacitors. A straight line is constructed for each of the plug-in capacitors according to size of holes where pins of the plug-in capacitor are to be inserted into. Paths of all transmission lines in the wiring diagram are obtained, and a determination of, whether any of the paths has at least one intersection point with at least one constructed straight line, is made. One or more paths, which have at least one intersection point with at least one constructed straight line, are recorded into a path list. The path list is then outputted using the computing device.

Abstract translation: 在计算设备，计算机化方法和非暂时性存储介质中，根据电容器的引脚信息，在接线图中从电容器中选择插入式电容器。 根据插入电容器的插脚孔的尺寸，为每个插入式电容器构建直线。 获得接线图中的所有传输线的路径，并且确定是否有任何路径与至少一个构造的直线至少具有一个交点。 具有至少一个与至少一个构造的直线的交点的一个或多个路径被记录到路径列表中。 然后使用计算设备输出路径列表。

公开(公告)号：US08458645B2

公开(公告)日：2013-06-04

申请号：US13407768

申请日：2012-02-29

Applicant: Chia-Nan Pai ,  Shou-Kuo Hsu ,  Ya-Ling Huang

Inventor： Chia-Nan Pai ,  Shou-Kuo Hsu ,  Ya-Ling Huang

IPC: G06F17/50 ,  G06F15/04

CPC classification number: G06F17/5081

Abstract: In a method for checking layout of a printed circuit board (PCB) using an electronic device, a signal line is selected from a layout diagram of the PCB. The method searches for signal lines which have an acute angle when deviating from a straight line in the layout diagram of the PCB. The method further locates attribute data of the searched signal lines in the layout diagram of the PCB, and displays the attribute data of the searched signal lines on a display device of the electronic device.

Abstract translation: 在使用电子设备检查印刷电路板（PCB）的布局的方法中，从PCB的布局图中选择信号线。 该方法搜索在PCB布局图中偏离直线时具有锐角的信号线。 该方法进一步在PCB的布局图中定位搜索到的信号线的属性数据，并将所搜索的信号线的属性数据显示在电子设备的显示装置上。