Invention Application
- Patent Title: LAYOUT STRUCTURE OF BALL GRID ARRAY
- Patent Title (中): 球网阵列布局结构
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Application No.: US11309542Application Date: 2006-08-18
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Publication No.: US20070114578A1Publication Date: 2007-05-24
- Inventor: Ya-Ling Huang
- Applicant: Ya-Ling Huang
- Applicant Address: TW Tu-Cheng
- Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: TW Tu-Cheng
- Priority: CN200510101741.X 20051124
- Main IPC: H01L29/80
- IPC: H01L29/80
Abstract:
A layout structure of ball grid array is provided. The layout structure includes: a substrate having a margin area; a plurality of solder ball pads laid on the substrate; a plurality of interconnection vias each electrically coupled to a corresponding one of the plurality of solder ball pads; and at least one of the plurality of interconnection vias arrayed on the margin area so that no interconnection vias are arrayed between one of the plurality of interconnection vias and an edge of the margin area.
Information query
IPC分类:
