发明申请
US20070114677A1 Semiconductor package with heat sink, stack package using the same and manufacturing method thereof
审中-公开
具有散热器的半导体封装，使用该散热器的堆叠封装及其制造方法
- 专利标题： Semiconductor package with heat sink, stack package using the same and manufacturing method thereof
- 专利标题（中）： 具有散热器的半导体封装，使用该散热器的堆叠封装及其制造方法
-
申请号： US11434143申请日： 2006-05-16
-
公开(公告)号： US20070114677A1公开(公告)日： 2007-05-24
- 发明人: Heung-Kyu Kwon , Tae-Hun Kim , Sung-Yong Park
- 申请人： Heung-Kyu Kwon , Tae-Hun Kim , Sung-Yong Park
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 优先权： KR2005-113113 20051124
- 主分类号： H01L23/28
- IPC分类号： H01L23/28
摘要：
A semiconductor package may include a heat sink. The heat sink may be disposed above and spaced apart from a substrate, which may support a semiconductor chip. The heat sink may have a hole. A liquid molding compound may be provided through the hole of the heat sink to form an encapsulant. The encapsulant may seal the semiconductor chip, leaving an upper portion of the heat sink exposed. A tape supporting the heat sink may be provided on the substrate. The tape may be removed after the encapsulant is provided.