摘要:
An aerosol generating device includes: a main body including a semi-exterior portion on a surface of which a 1-1st contact electrode and a 1-2nd contact electrode are formed to be apart from each other; a cover detachably coupled to the main body and including a 2-1st contact electrode corresponding to the 1-1st contact electrode and a 2-2nd contact electrode corresponding to the 1-2nd contact electrode; and a controller configured to determine that the cover is mounted on the main body when the 1-1st contact electrode and the 1-2nd contact electrode are electrically connected to each other.
摘要:
A multi-adapter for a vehicle wiper, having a joining portion coupled to a wiper blade with a pair of side plates protruding from the joining portion such that the side plates are parallel to each other. The side plates have a plurality of pin coupling portions formed at the pair of side plates, and to which wiper arm with pins of different sizes are selectively coupled. A plurality of protrusions are formed, on at least one of the pair of the side plates so as to maintain a gap between the wiper arm and the pair of side plates.
摘要:
There is provided a semiconductor light emitting device including: a light transmissive substrate; a light emitting part; first and second electrodes electrically connected to the first and second conductivity type semiconductor layers, respectively; and a rear reflective part including a reflective metallic layer, and a light transmissive dielectric layer interposed between the light transmissive substrate and the reflective metallic layer.
摘要:
Disclosed is a method of assembling a metal clamp and body springs of a wiper blade for vehicles, and an assembly. The method includes forming a plurality of through holes at major sides of the body springs, forming a plurality of protrusions corresponding to the through holes at a major side of the clamp such that the protrusions extend outward from the major side of the clamp, inserting the protrusions of the clamp into the respective through holes of the body springs, fixing the protrusions, which are located in the respective through holes, in the respective through holes by pressure welding or riveting such that the clamp is mounted to the body springs.
摘要:
A semiconductor package apparatus includes a first semiconductor package including a first semiconductor chip, a first substrate, a first terminal, and a first signal transfer medium, and a second semiconductor package including a second semiconductor chip, a second substrate, a second terminal, and a second signal transfer medium. At least one package connecting solder ball is located between the first terminal and the second terminal. A first solder ball guide member is positioned around the first terminal of the first substrate and includes a first guide surface for guiding a shape of the package connecting solder ball.
摘要:
An electronic device and a method for inputting information through touch input device of an electronic device is provided. The method inputs information including at least one of symbols and characters through touching of a screen displayed on the touch input device, and executes a specific application capable of processing the input information.
摘要:
There is provided a semiconductor light emitting diode (LED) chip including: a semiconductor light emitting diode unit including a light-transmissive substrate, and a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer sequentially formed on an upper surface of the light-transmissive substrate; a rear reflective laminate including an auxiliary optical layer formed on a lower surface of the light-transmissive substrate and made of a material having a predetermined refractive index and a metal reflective film formed on a lower surface of the auxiliary optical layer; and a bonding laminate provided on a lower surface of the rear reflective laminate and including a bonding metal layer made of a eutectic metal material and an anti-diffusion film formed to prevent diffusion of elements between the bonding metal layer and the metal reflective film.
摘要:
Example pop-up camera flashes are disclosed. A disclosed example pop-up flash of a camera includes a supporting unit; a rotating unit, which is rotatably connected to the supporting unit and is able to rotate between a first position, at which the rotating unit is adjacent to the supporting unit, and a second position, at which the rotating unit is apart from the supporting unit; a sliding unit, which is slidably combined with the rotating unit; a light emitting unit, which is arranged at the sliding unit; a connecting unit, of which a first end is rotatably connected to the sliding unit and a second end is rotatably connected to the supporting unit; and a driving unit, which is connected to the connecting unit and provides a driving force for rotation of the connecting unit.
摘要:
A semiconductor light emitting device includes: a light emitting diode unit including a light-transmissive substrate having a face sloped upwardly at a lower edge thereof. A rear reflective lamination body is formed on the lower face and the surrounding sloped face of the light-transmissive substrate. The rear reflective lamination body includes an optical auxiliary layer and a metal reflective film formed on a lower face of the optical auxiliary layer. A junction lamination body is provided to a lower face of the rear reflective lamination body. The junction lamination body including a junction metal layer made of a eutectic metal material and a diffusion barrier film.
摘要:
The present disclosure is related to a method for executing a menu in a mobile terminal, the method comprising; inputting a drawing pattern on a touch screen of the mobile terminal; displaying a menu corresponding to the drawing pattern and a sub menu thereof on the touch screen by comparing a pre-stored drawing pattern table with the drawing pattern; and executing the sub menu by selecting the sub menu and a mobile terminal thereof.