发明申请
- 专利标题： Semiconductor thin film using self-assembled monolayers and methods of production thereof
- 专利标题（中）： 使用自组装单层的半导体薄膜及其制造方法
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申请号： US11417026申请日： 2006-05-03
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公开(公告)号： US20070117279A1公开(公告)日： 2007-05-24
- 发明人: Hyeon Shin , Young Chung , Hyun Jeong , Sang Hyun , Jong Seon
- 申请人： Hyeon Shin , Young Chung , Hyun Jeong , Sang Hyun , Jong Seon
- 优先权： KR2005-111745 20051122
- 主分类号： H01L21/84
- IPC分类号： H01L21/84 ; H01L27/148 ; H01L21/31
摘要：
A semiconductor thin film using a self-assembled monolayer (SAM) and a method for producing the semiconductor thin film are provided. According to the semiconductor thin film, a uniform inorganic seed layer is formed by using the self-assembled monolayer so that the adhesion between an insulating layer and a semiconductor layer is enhanced and thus the surface tension is reduced, thereby allowing the semiconductor thin film to have high quality without defects.
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