Invention Application
- Patent Title: Continuous in-line monitoring and qualification of polishing rates
- Patent Title (中): 连续在线监测和抛光率资质
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Application No.: US11590655Application Date: 2006-10-30
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Publication No.: US20070123046A1Publication Date: 2007-05-31
- Inventor: Abraham Ravid , Doyle Bennett , Konstantin Smekalin
- Applicant: Abraham Ravid , Doyle Bennett , Konstantin Smekalin
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L21/76 ; H01L21/461
Abstract:
A CMP tool can be closed loop controlled by using data, for a first polished wafer, obtained by an in-line metrology station, an in-situ monitoring system, and/or an inter-platen monitoring system to continually monitor and qualify polishing rates for the processing of subsequent polished wafers.
Information query
IPC分类:
