发明申请
- 专利标题： Substrate cleaning method and substrate cleaning apparatus
- 专利标题（中）： 基板清洗方法和基板清洗装置
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申请号： US11606159申请日： 2006-11-30
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公开(公告)号： US20070125405A1公开(公告)日： 2007-06-07
- 发明人: Kenji Sekiguchi , Hiroki Ohno
- 申请人： Kenji Sekiguchi , Hiroki Ohno
- 专利权人： Tokyo Electron Limited
- 当前专利权人： Tokyo Electron Limited
- 优先权： JPJP2005-349132 20051202
- 主分类号： B08B3/00
- IPC分类号： B08B3/00 ; B08B7/00
摘要：
A substrate cleaning method, including a step of supplying a two-fluid spray made up of a liquid and a gas to the front surface of a substrate, is provided; wherein the supplying of the two-fluid spray is carried out using a mixture of purified water and isopropyl alcohol as a liquid; concentration of the isopropyl alcohol in the mixture is 10 to 60 wt %; and a particle rejection ratio is 80% or greater.
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