发明申请
- 专利标题： Substrate having minimum kerf width
- 专利标题（中）： 基板具有最小切口宽度
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申请号： US11301715申请日： 2005-12-13
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公开(公告)号： US20070132066A1公开(公告)日： 2007-06-14
- 发明人: Hem Takiar , Ken Wang , Chih-Chin Liao , Han-Shiao Chen
- 申请人： Hem Takiar , Ken Wang , Chih-Chin Liao , Han-Shiao Chen
- 主分类号： H01L23/544
- IPC分类号： H01L23/544
摘要：
A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages.
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