发明申请
- 专利标题： Thermal processing appparatus
- 专利标题（中）： 热处理设备
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申请号： US11525904申请日： 2006-09-25
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公开(公告)号： US20070137556A1公开(公告)日： 2007-06-21
- 发明人: Hiroshi Shinya , Takahiro Kitano
- 申请人： Hiroshi Shinya , Takahiro Kitano
- 申请人地址： JP Tokyo-To
- 专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人地址： JP Tokyo-To
- 优先权： JP2002-030360 20020207
- 主分类号： B05C13/02
- IPC分类号： B05C13/02
摘要：
A thermal processing apparatus has a discharger for discharging process gas from a processing chamber and a ceiling plate provided between the substrate and the discharger. The ceiling plate has apertures at different aperture ratios in accordance with distances from the center of the ceiling plate. The apparatus may have dischargers provided over concentric circles of the substrate and adjusters for adjusting a discharging amount of the corresponding discharger. The apparatus may have gas suppliers provided over the concentric circles of the substrate and adjusters each for adjusting a supply amount of the corresponding supplier.