A sputtering apparatus includes a cathode for generating a plasma; one or more target on a front surface of the cathode; a plurality of magnets at a first distance from a back of the cathode for generating a first magnetic field intensity in the plasma; and a plurality of guide members for moving the individual magnets in a direction substantially perpendicular to the cathode to a second distance from the back of the cathode to change the first magnetic field intensity to a second magnetic field intensity.