发明申请
- 专利标题： WIRE BONDING SYSTEM AND METHOD OF USE
- 专利标题（中）： 电线接合系统及其使用方法
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申请号： US11679730申请日： 2007-02-27
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公开(公告)号： US20070141754A1公开(公告)日： 2007-06-21
- 发明人: Won-Chul LIM
- 申请人： Won-Chul LIM
- 申请人地址： KR Gyeonggi-do
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Gyeonggi-do
- 优先权： KR2004-28634 20040426
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A semiconductor package wire bonding system and method of use are provided. The wire bonding system includes a heating block that heats and supports a printed circuit board on which a multi-layered semiconductor chip structure having an overhang is mounted. A support inserted through an opening in the printed circuit board supporting the overhang portion of the semiconductor chip structure is installed in a predetermined region of the heating block. Multiple supports on the heating block may support overhand portions on multiple semiconductor chip structures.
公开/授权文献
- US07425466B2 Wire bonding system and method of use 公开/授权日：2008-09-16
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