公开(公告)号：US20070141754A1

公开(公告)日：2007-06-21

申请号：US11679730

申请日：2007-02-27

申请人： Won-Chul LIM

发明人： Won-Chul LIM

IPC分类号： H01L21/00

CPC分类号： H01L24/85 ,  H01L24/48 ,  H01L24/78 ,  H01L25/0657 ,  H01L2224/48463 ,  H01L2224/78301 ,  H01L2224/85 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A semiconductor package wire bonding system and method of use are provided. The wire bonding system includes a heating block that heats and supports a printed circuit board on which a multi-layered semiconductor chip structure having an overhang is mounted. A support inserted through an opening in the printed circuit board supporting the overhang portion of the semiconductor chip structure is installed in a predetermined region of the heating block. Multiple supports on the heating block may support overhand portions on multiple semiconductor chip structures.

摘要翻译： 提供半导体封装引线接合系统和使用方法。 引线接合系统包括加热并支撑其上安装有具有突出端的多层半导体芯片结构的印刷电路板的加热块。 通过支撑半导体芯片结构的突出部分的印刷电路板中的开口插入的支撑件安装在加热块的预定区域中。 加热块上的多个支撑件可以支撑多个半导体芯片结构上的过分部分。

公开(公告)号：US20070290372A1

公开(公告)日：2007-12-20

申请号：US11761306

申请日：2007-06-11

申请人： Won-Chul LIM

发明人： Won-Chul LIM

IPC分类号： H01L23/52

CPC分类号： H01L24/85 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05599 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/4845 ,  H01L2224/48465 ,  H01L2224/7825 ,  H01L2224/78301 ,  H01L2224/78313 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2224/859 ,  H01L2224/85947 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20303 ,  H01L2924/20304 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device having a wire loop and a method and apparatus for manufacturing the semiconductor device are provided. The semiconductor device includes a wiring board having an electrode pad, a semiconductor chip having a bonding pad and attached on a top surface of the wiring board while exposing the electrode pad, and a wire loop electrically connecting the bonding pad of the semiconductor chip to the electrode pad of the wiring board. The wire loop includes a contact ball bonded on the bonding pad and a wire extending from a side portion of the contact ball and bonded on the electrode pad of the wiring board.

摘要翻译： 提供一种具有线环的半导体器件及其制造方法和装置。 该半导体器件包括具有电极焊盘的布线板，具有接合焊盘的半导体芯片，并且在暴露电极焊盘的同时将电极焊盘暴露在布线板的上表面上，以及将半导体芯片的焊盘电连接到 电路板的电极板。 线圈包括接合焊盘上的接触球和从接触球的侧部延伸并接合在接线板的电极焊盘上的线。

公开(公告)号：US20100014264A1

公开(公告)日：2010-01-21

申请号：US12348175

申请日：2009-01-02

申请人： Won-Chul LIM

发明人： Won-Chul LIM

IPC分类号： H05K7/00 ,  H05K1/02

CPC分类号： H05K3/242 ,  H01L21/4846 ,  H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/117 ,  H05K3/0052 ,  H05K2203/049 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A PCB (printed circuit board) for manufacturing a semiconductor package. The PCB includes a plurality of semiconductor package unit frames; a scribe lane dividing the plurality of semiconductor package unit frames; and a printed circuit pattern for plating directly connected to a plurality of bond fingers on the semiconductor package unit frames and disposed to cross the scribe lane between adjacent semiconductor package unit frames.

摘要翻译： 一种用于制造半导体封装的PCB（印刷电路板）。 PCB包括多个半导体封装单元框架; 划分所述多个半导体封装单元框架的划线; 以及用于电镀的印刷电路图案，其直接连接到半导体封装单元框架上的多个键合指状物并且设置成跨越相邻半导体封装单元框架之间的划线。