发明申请
- 专利标题: THERMALLY ISOLATED VIA STRUCTURE
- 专利标题(中): 通过结构热隔离
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申请号: US11681964申请日: 2007-03-05
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公开(公告)号: US20070143994A1公开(公告)日: 2007-06-28
- 发明人: Anthony Primavera , Steven Findell
- 申请人: Anthony Primavera , Steven Findell
- 申请人地址: US MN ST. PAUL 55112-5798
- 专利权人: Cardiac Pacemakers, Inc.
- 当前专利权人: Cardiac Pacemakers, Inc.
- 当前专利权人地址: US MN ST. PAUL 55112-5798
- 主分类号: H01L21/331
- IPC分类号: H01L21/331
摘要:
This document discusses, among other things, a flexible circuit or other laminate comprising a first conductive layer and a second conductive layer disposed over the first conductive layer. An insulator is disposed between the first and second conductive layers. A conductive via extends through the insulator and electrically connects the first and second conductive layers. The laminate includes a channel in the insulator. In one option, the channel extends at least part way around the via. In another option, the channel extends at least part way between the first and second conductive layers. In another example, a method comprises providing a laminate including at least first and second conductive layers and an insulator disposed therebetween. A via is formed through the insulator. A channel is formed in the insulator at least part way around the via. The channel extends between the first and second conductive layers.
公开/授权文献
- US07617598B2 Method of making a thermally isolated via structure 公开/授权日:2009-11-17