公开(公告)号：US20060012027A1

公开(公告)日：2006-01-19

申请号：US10892648

申请日：2004-07-16

申请人： Anthony Primavera ,  Steven Findell

发明人： Anthony Primavera ,  Steven Findell

IPC分类号： H01L23/12 ,  H01L23/053 ,  H01L21/4763

CPC分类号： H05K1/0271 ,  H05K1/0201 ,  H05K1/0269 ,  H05K1/0272 ,  H05K1/115 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/0394 ,  H05K2201/062 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09509 ,  H05K2203/161 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204

摘要： This document discusses, among other things, a flexible circuit or other laminate comprising a first conductive layer and a second conductive layer disposed over the first conductive layer. An insulator is disposed between the first and second conductive layers. A conductive via extends through the insulator and electrically connects the first and second conductive layers. The laminate includes a channel in the insulator. In one option, the channel extends at least part way around the via. In another option, the channel extends at least part way between the first and second conductive layers. In another example, a method comprises providing a laminate including at least first and second conductive layers and an insulator disposed therebetween. A via is formed through the insulator. A channel is formed in the insulator at least part way around the via. The channel extends between the first and second conductive layers.

摘要翻译： 本文件尤其涉及柔性电路或其它层压体，其包括设置在第一导电层上的第一导电层和第二导电层。 绝缘体设置在第一和第二导电层之间。 导电通孔延伸穿过绝缘体并电连接第一和第二导电层。 层压板包括绝缘体中的通道。 在一个选项中，通道至少部分地围绕通道延伸。 在另一选择中，通道至少部分地在第一和第二导电层之间延伸。 在另一示例中，一种方法包括提供包括至少第一和第二导电层以及设置在其间的绝缘体的层压体。 通孔通过绝缘体形成。 在绝缘体中至少部分地围绕通孔形成通道。 通道在第一和第二导电层之间延伸。

公开(公告)号：US20070143994A1

公开(公告)日：2007-06-28

申请号：US11681964

申请日：2007-03-05

申请人： Anthony Primavera ,  Steven Findell

发明人： Anthony Primavera ,  Steven Findell

IPC分类号： H01L21/331

CPC分类号： H05K1/0271 ,  H05K1/0201 ,  H05K1/0269 ,  H05K1/0272 ,  H05K1/115 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/0394 ,  H05K2201/062 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09509 ,  H05K2203/161 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204

摘要： This document discusses, among other things, a flexible circuit or other laminate comprising a first conductive layer and a second conductive layer disposed over the first conductive layer. An insulator is disposed between the first and second conductive layers. A conductive via extends through the insulator and electrically connects the first and second conductive layers. The laminate includes a channel in the insulator. In one option, the channel extends at least part way around the via. In another option, the channel extends at least part way between the first and second conductive layers. In another example, a method comprises providing a laminate including at least first and second conductive layers and an insulator disposed therebetween. A via is formed through the insulator. A channel is formed in the insulator at least part way around the via. The channel extends between the first and second conductive layers.

摘要翻译： 本文件尤其涉及柔性电路或其它层压体，其包括设置在第一导电层上的第一导电层和第二导电层。 绝缘体设置在第一和第二导电层之间。 导电通孔延伸穿过绝缘体并电连接第一和第二导电层。 层压板包括绝缘体中的通道。 在一个选项中，通道至少部分地围绕通道延伸。 在另一选择中，通道至少部分地在第一和第二导电层之间延伸。 在另一示例中，一种方法包括提供包括至少第一和第二导电层以及设置在其间的绝缘体的层压体。 通孔通过绝缘体形成。 在绝缘体中至少部分地围绕通孔形成通道。 通道在第一和第二导电层之间延伸。