发明申请
- 专利标题： System and method for flip chip substrate pad
- 专利标题（中）： 倒装芯片基板焊盘的系统和方法
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申请号： US11318840申请日： 2005-12-27
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公开(公告)号： US20070148951A1公开(公告)日： 2007-06-28
- 发明人: Mengzhi Pang , Omar Bchir
- 申请人： Mengzhi Pang , Omar Bchir
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
According to some embodiments, a method, a system, and an apparatus to provide a flip chip conductive bump pad that has a dome shaped area. In some embodiments, the method includes providing a substrate having a conductive bump pad on a first surface of the substrate and forming a dome shaped conductive area on a center area of the conductive bump pad.