发明申请
US20070151213A1 Methods for making temporary electronic component-carrying tapes with weakened areas
审中-公开
制造具有弱化区域的临时电子元件承载带的方法
- 专利标题： Methods for making temporary electronic component-carrying tapes with weakened areas
- 专利标题（中）： 制造具有弱化区域的临时电子元件承载带的方法
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申请号： US11717833申请日： 2007-03-14
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公开(公告)号： US20070151213A1公开(公告)日： 2007-07-05
- 发明人: Michael Butler
- 申请人： Michael Butler
- 主分类号： B65B47/00
- IPC分类号： B65B47/00
摘要：
A method for forming flexible temporary component-carrier tapes, which are used for storing, transporting and supplying components, includes forming apertures for receiving the components in a device-retaining layer, securing a top cover layer to a surface of the device-retaining layer, and securing a bottom layer to an opposite surface of the device-retaining layer. Weakened regions may be formed in one or more of the layers.