发明申请
- 专利标题： Fluxless heat spreader bonding with cold form solder
- 专利标题（中）： 无焊散热器与冷成型焊料接合
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申请号： US11323904申请日： 2005-12-29
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公开(公告)号： US20070152321A1公开(公告)日： 2007-07-05
- 发明人: Wei Shi , Daoqiang Lu , Qing Zhou , Jiangqi He
- 申请人： Wei Shi , Daoqiang Lu , Qing Zhou , Jiangqi He
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L21/50
摘要：
The formation of electronic assemblies including a heat spreader coupled to at least one die is described. One embodiment relates to a method including positioning a solder on a heat spreader. The method also includes forming a solid state diffusion bond between the solder and the heat spreader. The solid state diffusion bonded solder and heat spreader are positioned on a die and heated to a temperature sufficient to melt the solder and form a bond between the solder and the die, in the absence of a flux. Other embodiments are described and claimed.
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