A semiconductor chip, a tape package of the chip and a tape wiring substrate of the chip may be configured so as to effectively radiate heat generated from the chip externally through certain wiring patterns connected to certain pads. In an example, the chip may include a plurality of input pads along at least one edge of an active surface. The input pads may include power pads and ground pads. The chip may include a plurality of output pads along edges of the active surface, outside of the input pads. The power pads and the ground pads may be located at a central area of the at least one edge.