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21 条记录 (耗时 0.022 秒)

    Method of fabricating multi-layered printed circuit board for optical waveguides
    3.
    发明授权
    Method of fabricating multi-layered printed circuit board for optical waveguides 有权
    制造光波导多层印刷电路板的方法

    公开(公告)号：US07046870B2

    公开(公告)日：2006-05-16

    申请号：US10610820

    申请日：2003-07-02

    申请人： Young-Woo Kim ,  Young-Sang Cho ,  Dek-Gin Yang ,  Kyu-Hyok Yim

    发明人： Young-Woo Kim ,  Young-Sang Cho ,  Dek-Gin Yang ,  Kyu-Hyok Yim

    IPC分类号： G02B6/12 ,  G02B6/13

    CPC分类号： G02B6/43 ,  G02B6/3608 ,  G02B6/4201 ,  G02B6/4214 ,  G02B6/428 ,  H05K1/0274 ,  H05K3/4611 ,  H05K2203/063 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T156/1064

    摘要： Disclosed is a method of fabricating a multi-layered PCB, in which the optical waveguide component is inserted into the PCB in such a way that a prepreg adhesive does not block an optical signal entrance of the optical waveguide. The method comprises pre-routing a portion of an adhesive meeting the optical waveguide to remove said portion, processing an adhesive weeping prevention layer so as to prevent the adhesive from blocking the optical signal entrance of the optical waveguide, arranging the optical waveguide, the adhesive, and the adhesive weeping prevention layer on a copper clad laminate, and combining the optical waveguide, a prepreg, and the adhesive weeping prevention layer with each other into a single structure. The adhesive weeping prevention layer is selected from the group consisting of a prepreg, a single-sided copper clad laminate, a thermally curable resin, a heat spreader, and an unclad.

    摘要翻译： 公开了一种制造多层PCB的方法，其中将光波导部件插入到PCB中，使得预浸胶粘合剂不阻挡光波导的光信号入口。 该方法包括预先路由满足光波导的粘合剂部分以去除所述部分，处理粘合剂防止漏水层，以防止粘合剂阻挡光波导的光信号入口，布置光波导，粘合剂 和覆铜层压板上的粘合剂防止层，并将光波导，预浸料和粘合剂防止层彼此组合成单一结构。 粘合防止层选自预浸料，单面覆铜层压板，热固化树脂，散热器和未包覆层。

    Method for anion removal by forming chemical precipitation under an electric field and continuous process for anion removal
    4.
    发明授权
    Method for anion removal by forming chemical precipitation under an electric field and continuous process for anion removal 失效
    通过在电场下形成化学沉淀和阴离子去除的连续方法进行阴离子去除的方法

    公开(公告)号：US06811704B2

    公开(公告)日：2004-11-02

    申请号：US10278007

    申请日：2002-10-22

    申请人： Young-Sang Cho ,  Jae-Ik Kim ,  Jae-Chun Oh ,  Jin-Seong Yoon

    发明人： Young-Sang Cho ,  Jae-Ik Kim ,  Jae-Chun Oh ,  Jin-Seong Yoon

    IPC分类号： C02F162

    CPC分类号： C02F1/5245 ,  C02F2101/10 ,  C02F2101/105 ,  C02F2101/12 ,  C02F2101/163 ,  Y10S210/912

    摘要： The present disclosure relates to a method for removing anions such as nitrate ion, sulfate ion, chloride ion, and phosphate ion existing in underground water, surface water or waste water. The method involves adding alumina cement and a calcium compound to the water containing the anion followed by applying an electric field thereto, thereby forming a chemical precipitate which is an insoluble complex salt. The disclosure also relates to a continuous process for removing the anion by continuously performing the above method for removing anions.

    摘要翻译： 本公开涉及一种去除存在于地下水，地表水或废水中的硝酸根离子，硫酸根离子，氯离子和磷酸根离子等阴离子的方法。 该方法包括向含有阴离子的水中加入氧化铝水泥和钙化合物，然后向其施加电场，从而形成化学沉淀物，其为不溶性络盐。 本公开还涉及通过连续进行上述除去阴离子的方法除去阴离子的连续方法。

    Method of fabricating multi-layered printed circuit board for optical waveguides
    5.
    发明申请
    Method of fabricating multi-layered printed circuit board for optical waveguides 失效
    制造光波导多层印刷电路板的方法

    公开(公告)号：US20060182385A1

    公开(公告)日：2006-08-17

    申请号：US11401915

    申请日：2006-04-12

    申请人： Young-Woo Kim ,  Young-Sang Cho ,  Dek-Gin Yang ,  Kyu-Hyok Yim

    发明人： Young-Woo Kim ,  Young-Sang Cho ,  Dek-Gin Yang ,  Kyu-Hyok Yim

    IPC分类号： G02B6/12

    CPC分类号： G02B6/43 ,  G02B6/3608 ,  G02B6/4201 ,  G02B6/4214 ,  G02B6/428 ,  H05K1/0274 ,  H05K3/4611 ,  H05K2203/063 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T156/1064

    摘要： Disclosed is a method of fabricating a multi-layered PCB, in which the optical waveguide component is inserted into the PCB in such a way that a prepreg adhesive does not block an optical signal entrance of the optical waveguide. The method comprises pre-routing a portion of an adhesive meeting the optical waveguide to remove said portion, processing an adhesive weeping prevention layer so as to prevent the adhesive from blocking the optical signal entrance of the optical waveguide, arranging the optical waveguide, the adhesive, and the adhesive weeping prevention layer on a copper clad laminate, and combining the optical waveguide, a prepreg, and the adhesive weeping prevention layer with each other into a single structure. The adhesive weeping prevention layer is selected from the group consisting of a prepreg, a single-sided copper clad laminate, a thermally curable resin, a heat spreader, and an unclad. Therefore, the method is advantageous in that the prepreg and the adhesive weeping prevention layer are pre-routed to prevent epoxy resin from blocking the optical signal entrance of the optical waveguide, thereby facilitating precise interfacing of optical signals.

    摘要翻译： 公开了一种制造多层PCB的方法，其中将光波导部件插入到PCB中，使得预浸胶粘合剂不阻挡光波导的光信号入口。 该方法包括预先路由满足光波导的粘合剂部分以去除所述部分，处理粘合剂防止漏水层，以防止粘合剂阻挡光波导的光信号入口，布置光波导，粘合剂 和覆铜层压板上的粘合剂防止层，并将光波导，预浸料和粘合剂防止层彼此组合成单一结构。 粘合防止层选自预浸料，单面覆铜层压板，热固化树脂，散热器和未包覆层。 因此，该方法的优点在于预浸布和粘合剂防止漏水层被预先布线以防止环氧树脂阻挡光波导的光信号入口，从而有助于光信号的精确接口。

    Multi-layer printed circuit board and the method for coupling optical signals between layers of multi-layer printed circuit board
    7.
    发明授权
    Multi-layer printed circuit board and the method for coupling optical signals between layers of multi-layer printed circuit board 失效
    多层印刷电路板和多层印刷电路板层之间耦合光信号的方法

    公开(公告)号：US06839476B2

    公开(公告)日：2005-01-04

    申请号：US10417357

    申请日：2003-04-16

    申请人： Young-Woo Kim ,  Byoung-Ho Rhee ,  Dek-Gin Yang ,  Young-Sang Cho ,  Kyu-Hyok Yim

    发明人： Young-Woo Kim ,  Byoung-Ho Rhee ,  Dek-Gin Yang ,  Young-Sang Cho ,  Kyu-Hyok Yim

    IPC分类号： G02B6/42 ,  G02B6/43 ,  G02B6/12

    CPC分类号： G02B6/43 ,  G02B6/122 ,  G02B6/30 ,  G02B6/3636 ,  G02B6/3652

    摘要： Disclosed herein is an optical signal coupling block, and a multi-layer printed circuit board and the method for coupling optical signals between layers of a multi-layer printed circuit board (PCB) using optical signal coupling blocks. The optical signals between the layers are coupled through the steps of forming a plurality of optical via holes in the multi-layer PCB to which optical waveguides for transmitting optical signals are attached; inserting the optical signal coupling blocks into the plural optical via holes such that the optical signal coupling blocks are connected to the optical waveguides to transmit the optical signals; forming at least one connection part to couple optical signals between the optical waveguides and the optical signal coupling blocks; and interconnecting the optical waveguides and the optical signal coupling blocks by aligning positions of the optical waveguides and the optical signal coupling blocks.

    摘要翻译： 本文公开了一种光信号耦合块和多层印刷电路板以及使用光信号耦合块在多层印刷电路板（PCB）的层之间耦合光信号的方法。 层之间的光信号通过在多层PCB中形成多个光通孔的步骤耦合，多层PCB中连接有用于传输光信号的光波导; 将光信号耦合块插入到多个光通孔中，使得光信号耦合块连接到光波导以传输光信号; 形成至少一个连接部分以在所述光波导和所述光信号耦合块之间耦合光信号; 以及通过对准光波导和光信号耦合块的位置来互连光波导和光信号耦合块。

    STEEL-CONCRETE COMPOSITE BEAM AND CONSTRUCTION METHOD USING SAME
    8.
    发明申请
    STEEL-CONCRETE COMPOSITE BEAM AND CONSTRUCTION METHOD USING SAME 审中-公开
    钢 - 混凝土复合梁及其构造方法

    公开(公告)号：US20110225927A1

    公开(公告)日：2011-09-22

    申请号：US13124997

    申请日：2009-07-08

    申请人： Jeom-Han Kim ,  Young-Sang Cho ,  Eun-Ho Jeong ,  Kyoung-Hun Lee

    发明人： Jeom-Han Kim ,  Young-Sang Cho ,  Eun-Ho Jeong ,  Kyoung-Hun Lee

    IPC分类号： E04C3/293 ,  E04C3/04 ,  E04B1/38

    CPC分类号： E04C3/293

    摘要： A steel-concrete composite beam includes a long rectangular steel frame; concrete members installed at only both ends of the steel frame, excluding a center portion thereof; a prestressable reinforcement buried in the concrete member; and a stirrup reinforcement arranged to the concrete member with a regular gap thereto to surround a lower flange of the steel frame.

    摘要翻译： 钢筋混凝土复合梁包括长方形钢框架; 仅在钢框架的两端安装的混凝土构件，不包括其中心部分; 埋在混凝土构件中的预应力钢筋; 以及将钢筋加固件布置到具有规则间隙的混凝土构件上以围绕钢框架的下凸缘。

    Printed circuit board with opto-via holes and process of forming the opto-via holes
    10.
    发明授权
    Printed circuit board with opto-via holes and process of forming the opto-via holes 失效
    具有光通孔的印刷电路板和形成光通孔的工艺

    公开(公告)号：US06996305B2

    公开(公告)日：2006-02-07

    申请号：US10625550

    申请日：2003-07-24

    申请人： Young-Woo Kim ,  Young-Sang Cho ,  Dek-Gin Yang ,  Kyu-Hyok Yim

    发明人： Young-Woo Kim ,  Young-Sang Cho ,  Dek-Gin Yang ,  Kyu-Hyok Yim

    IPC分类号： G02B6/26 ,  G02B6/42 ,  G02B6/12

    CPC分类号： G02B6/43 ,  H05K1/0274 ,  H05K3/429 ,  H05K3/4623

    摘要： Disclosed is a printed circuit board with opto-via holes for transmitting an optical signal to an optical waveguide in the PCB, and a process of forming the opto-via holes. The process comprises forming a plurality of via holes on a plurality of copper clad laminates using a drill, plating an inner wall of each via hole, exposing and etching the plated portions of an upper and lower side of each copper clad laminate to form a circuit pattern on the upper and lower side of the copper clad laminate, layering the patterned copper clad laminates on each other using an insulating resin adhesive, and removing the insulating resin adhesive in the predetermined via holes to form opto-via holes. Therefore, the process is advantageous in that the optical signal is stably transmitted to the optical waveguide in the PCB without damage to the optical waveguide directly exposed to an external environment, and the optical waveguide suitable to physical properties of the material constituting the PCB is easily inserted between the inner layer and the outer layer.

    摘要翻译： 公开了一种具有用于将光信号传输到PCB中的光波导的光通孔的印刷电路板以及形成光通孔的工艺。 该方法包括使用钻头在多个覆铜层压板上形成多个通孔，电镀每个通孔的内壁，暴露和蚀刻每个覆铜层压板的上侧和下侧的电镀部分，以形成电路 在覆铜层压板的上下侧形成图案，使用绝缘树脂粘合剂将图案化的铜包覆层压体层叠，并且除去预定通孔中的绝缘树脂粘合剂以形成光通孔。 因此，该方法的优点在于，光信号稳定地传输到PCB中的光波导而不损害直接暴露于外部环境的光波导，并且适合于构成PCB的材料的物理性质的光波导容易 插入在内层和外层之间。