发明申请
- 专利标题: Insulated implantable electrical circuit
- 专利标题(中): 绝缘可植入电路
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申请号: US10638989申请日: 2003-08-11
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公开(公告)号: US20070158100A1公开(公告)日: 2007-07-12
- 发明人: Robert Greenberg , Neil Talbot , Jerry Ok , Jordan Neysmith
- 申请人: Robert Greenberg , Neil Talbot , Jerry Ok , Jordan Neysmith
- 主分类号: H05K1/00
- IPC分类号: H05K1/00 ; H05K3/10
摘要:
The invention is directed to an implant able insulated electrical circuit that utilizes polyparaxylylene, preferably as Parylene, a known polymer that has excellent living tissue implant characteristics, to provide for chronic implantation of conductive electrical devices, such as stimulators and sensors. The device is thin, flexible, electrically insulated, and stable after long exposure to living tissue. Layers of Parylene may be combined with layers of a polymer, such as polyimide, to yield greater design flexibility in the circuit. Multiple electrical conduction layers may be stacked in the circuit to increase packing density.
公开/授权文献
- US08380326B2 Insulated implantable electrical circuit 公开/授权日:2013-02-19
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