Invention Application
- Patent Title: Insulated implantable electrical circuit
- Patent Title (中): 绝缘可植入电路
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Application No.: US10638989Application Date: 2003-08-11
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Publication No.: US20070158100A1Publication Date: 2007-07-12
- Inventor: Robert Greenberg , Neil Talbot , Jerry Ok , Jordan Neysmith
- Applicant: Robert Greenberg , Neil Talbot , Jerry Ok , Jordan Neysmith
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K3/10

Abstract:
The invention is directed to an implant able insulated electrical circuit that utilizes polyparaxylylene, preferably as Parylene, a known polymer that has excellent living tissue implant characteristics, to provide for chronic implantation of conductive electrical devices, such as stimulators and sensors. The device is thin, flexible, electrically insulated, and stable after long exposure to living tissue. Layers of Parylene may be combined with layers of a polymer, such as polyimide, to yield greater design flexibility in the circuit. Multiple electrical conduction layers may be stacked in the circuit to increase packing density.
Public/Granted literature
- US08380326B2 Insulated implantable electrical circuit Public/Granted day:2013-02-19
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