Wire connection failure in semiconductor device is prevented.A semiconductor device has a package substrate having, at the periphery of the main surface thereof, a plurality of bonding leads disposed in a row, a semiconductor chip mounted inside of the row of the bonding leads on the main surface of the package substrate, wires for connecting pads of the semiconductor chip and the bonding leads of the substrate, a sealing body for resin sealing the semiconductor chip and the plurality of wires, and a plurality of solder bumps disposed on the back surface of the package substrate. The top of the loop of each of the wires is disposed outside the wire connecting portion so that the wire length wire can be increased in the connection between the bonding leads and the pads of the semiconductor chip. As a result, the wires have a stable loop shape and a wire connection failure can be prevented.