A method and system of testing an electronic device can be performed by estimating the die temperature using correlation data previously collected for other electronic devices. In one embodiment, correlation data can include (1) die temperatures measured and (2) currents drawn by the electronic devices, testing voltages for the electronic devices, or powers consumed by the electronic devices during the testing. The correlation data can be used to generate an equation or be stored in a table. A method of testing a subsequent electronic device can include testing the subsequent electronic device. The method can also include estimating a die temperature for the subsequent electronic device during testing, wherein the die temperature can be estimated at least in part using a current drawn by the subsequent electronic device, a testing voltage for the subsequent electronic device, or a power consumed by the subsequent electronic device.