发明申请
- 专利标题： Semiconductor wafer processing tape winding body, semiconductor wafer processing tape sticking apparatus and semiconductor wafer processing apparatus that use the semiconductor wafer processing tape winding body
- 专利标题（中）： 半导体晶片处理带卷绕体，半导体晶片加工带贴附装置以及半导体晶片加工带卷绕体的半导体晶片处理装置
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申请号： US11476382申请日： 2006-06-28
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公开(公告)号： US20070162175A1公开(公告)日： 2007-07-12
- 发明人: Takeshi Segawa , Koichi Yamaguchi , Yuichi Iwakata
- 申请人： Takeshi Segawa , Koichi Yamaguchi , Yuichi Iwakata
- 申请人地址： JP Itabashi-ku
- 专利权人： Lintec Corporation
- 当前专利权人： Lintec Corporation
- 当前专利权人地址： JP Itabashi-ku
- 优先权： JP2005-190388 20050629
- 主分类号： G06F19/00
- IPC分类号： G06F19/00
摘要：
A semiconductor wafer processing tape sticking apparatus is provided and is capable of sticking a semiconductor wafer processing tape to a semiconductor wafer under the optimum conditions based on the processing data that has been written to a data carrier member and that has been read from the data carrier member without accessing the host computer unlike a conventional method. The semiconductor wafer processing tape sticking apparatus includes: a feeding apparatus provided with a feeding shaft to which a semiconductor wafer processing tape winding body can be detachably attached; a tape data read/write device for reading and writing the processing data that has been written to a data carrier member of the semiconductor wafer processing tape winding body; and a tape sticking apparatus for sticking a semiconductor wafer processing tape that has been fed out from the feeding apparatus to the semiconductor wafer based on the processing data that has been read by the tape data read/write device.
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