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1.发明申请Structure with a built-in recording medium, a laminate comprising the structure and method for recording in non-contact manner using the structure and the laminate 有权具有内置记录介质的结构，包括使用该结构和层压体以非接触方式记录的结构和方法的层压体公开(公告)号：US20080119359A1
公开(公告)日：2008-05-22
申请号：US11978515
申请日：2007-10-29
IPC分类号： B41M5/24
CPC分类号： B41M5/305 , B41M2205/04 , B41M2205/38 , B41M2205/40
摘要： A structure formed of a resin material with a built-in recording medium comprising at least a means for rewriting visible information with a laser light in a non-contact manner; a laminate comprising the structure and a method for recording in the non-contact manner using the structure or the laminate are disclosed. The recording and erasing of information in the recording medium can be conducted by irradiation with a laser light from outside. The laser light transmittance in a used wave length range and the visible light transmittance through a portion of the structure from a surface on which the laser light is irradiated to the recording medium are in a specified range. Surface destruction of the recording medium due to laser light on rewriting visible information, decrease in durability during cleaning, damages on the recording medium during transportation and deterioration in the color developing property due to light can be overcome.
摘要翻译： 由具有内置记录介质的树脂材料形成的结构至少包括用于以非接触方式用激光重写可见信息的装置; 公开了一种包含该结构的层压体以及使用该结构或层压体以非接触方式进行记录的方法。 记录介质中的信息的记录和擦除可以通过从外部照射激光来进行。 在使用的波长范围内的激光透射率和从激光照射到记录介质的表面的结构的一部分的可见光透射率在规定的范围内。 可以克服在重写可见信息时由于激光引起的记录介质的表面破坏，清洁期间的耐久性降低，运输期间记录介质的损坏以及由于光引起的显色性的劣化。
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公开(公告)号：US08465011B2
公开(公告)日：2013-06-18
申请号：US12452647
申请日：2008-07-31
申请人： Takeshi Segawa , Kiyofumi Tanaka
发明人： Takeshi Segawa , Kiyofumi Tanaka
IPC分类号： H01L21/683 , B25B11/00
CPC分类号： H01L21/67132 , H01L21/6838 , Y10T29/49998 , Y10T156/1132
摘要： A fixing jig is made up of a plate-like jig main body (2) and a close contact layer (3) which detachably holds a work (W) in close contact therewith. The jig main body has: on one surface thereof a plurality of supporting projections (4) to support the close contact layer; and also has, along an outer peripheral portion of said one surface, a side wall (5) which is of substantially the same height as the supporting projections. The close contact layer is adhered to an end surface of the side wall to thereby define a partitioned space (6) between the close contact layer and the jig main body. By sucking the air within the partitioned space via a ventilation hole (7) formed in the jig main body, the close contact layer is deformed. The work is thus surely supported and fixed also in performing a processing in which a force is applied to the work. The jig main body (2) has formed therein a suction hole (8) which opens into an outer surface on the side of the close contact layer (3) but which is not communicated with the partitioned space (6). A through hole (9) in communication with the suction hole (8) is formed in the close contact layer (3). A suction force is applied to the work W by evacuation of the suction hole (8).
摘要翻译： 固定夹具由能够可拆卸地保持工件（W）紧密接触的板状夹具主体（2）和紧密接触层（3）构成。 夹具主体在其一个表面上具有多个支撑突起（4）以支撑紧密接触层; 并且沿着所述一个表面的外周部分具有与所述支撑突起基本相同的高度的侧壁（5）。 紧密接触层粘附到侧壁的端面，从而在紧密接触层和夹具主体之间限定分隔空间（6）。 通过在夹具主体中形成的通气孔（7）吸入分隔空间内的空气，使紧密接触层发生变形。 因此，在对作业施加力的处理中，确实地支撑和固定工件。 夹具主体（2）上形成有向密闭接触层（3）侧的外表面开口但不与分隔空间（6）连通的吸入孔（8）。 在紧密接触层（3）中形成有与抽吸孔（8）连通的通孔（9）。 通过抽吸吸入孔（8）将吸力施加到工件W。
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公开(公告)号：US20090302112A1
公开(公告)日：2009-12-10
申请号：US12479110
申请日：2009-06-05
申请人： Takeshi SEGAWA
发明人： Takeshi SEGAWA
IPC分类号： G06K7/08
CPC分类号： G07G1/0018 , G06Q20/042
摘要： An information media processing device may include a transport passage in which an information medium having MICR characters printed in a predetermined print position thereon is transported, a magnetic head arranged in the transport passage for detecting magnetism of the MICR characters, an image reading means arranged in the transport passage for reading the image of the information medium, a transporting means arranged in the transport passage, which has a shifting mechanism for shifting the information medium into an area in which the magnetic head can make magnetic detection, and a controller which detects the reference edge of the information medium based on the image read by the image reading means to judge if the print position is distanced by a predetermined amount or more from the magnetically-detectable area of the magnetic head based on the reference edge; when the print position is distanced by a predetermined amount or more, the transporting means shifts the information medium into the magnetically-detectable area while transporting the information medium.
摘要翻译： 信息媒体处理装置可以包括：传送通道，其中传送在其上的预定打印位置印刷有MICR字符的信息媒体;布置在传送通道中的磁头，用于检测MICR字符的磁性;图像读取装置， 用于读取信息介质的图像的传送通道，布置在传送通道中的传送装置，其具有用于将信息介质移动到磁头可以进行磁检测的区域中的移位机构;以及控制器， 基于由图像读取装置读取的图像的信息介质的参考边缘，以基于参考边缘从磁头的磁性可检测区域判断打印位置是否距离预定量以上; 当打印位置距离预定量或更多时，传送装置在传送信息介质的同时将信息介质移动到磁性可检测区域。
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4.发明申请HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAFER PROTECTING STRUCTURE AND SEMICONDUCTOR WAFER GRINDING METHOD AND SEMICONDUCTOR CHIP FABRICATION METHOD USING THE STRUCTURE 有权控制晶圆，半导体晶粒磨削方法，半导体晶体保护结构和半导体晶粒研磨方法及半导体芯片制造方法公开(公告)号：US20090081852A1
公开(公告)日：2009-03-26
申请号：US12282984
申请日：2007-03-09
IPC分类号： H01L21/304 , B24B41/06
CPC分类号： H01L21/6875 , B24B37/042 , B24B41/061 , B65G49/061 , B65G2249/045 , Y10T428/24322
摘要： A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.
摘要翻译： 半导体晶片W的背面研磨机10包括：设置在安装件11的工作面上的工作台13; 通过表13上的检查台15布置多个保持夹具20; 用于进行通过保持夹具20保持的半导体晶片W的后侧的研磨处理的研磨机30; 以及用于接地半导体晶片W的洗涤装置40.每个保持夹具20由在基板21的表面上凹陷的凹部22构成，多个支撑突起23投影地排列在凹部22的底面上， 接触膜24，覆盖凹部22，由多个支撑突起23支撑，用于可拆卸地保持半导体晶片W与其紧密接触; 以及用于将空气从由接触膜24覆盖的凹部22引导到外部的排气路径25。
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公开(公告)号：US07470436B2
公开(公告)日：2008-12-30
申请号：US10537433
申请日：2003-12-02
申请人： Takeshi Segawa , Atsuko Abe , Tsuyoshi Minemura , Hironori Kubota
发明人： Takeshi Segawa , Atsuko Abe , Tsuyoshi Minemura , Hironori Kubota
CPC分类号： A61K31/122 , A23L29/10 , A23L33/10 , A23L33/115 , A61K8/355 , A61K8/375 , A61K9/08 , A61K47/14 , A61Q19/00 , A61Q19/007 , A61Q19/08
摘要： A water-soluble composition comprising (A) coenzyme Q10 of 5-40% by weight, (B) monoester of polyglycerol with average polymerization degree of 10 and fatty acid with 18 carbon atoms of 5-30% by weight, (C) mono-, di-, tri- or penta-ester of polyglycerol with average polymerization degree of 3-6 and fatty acid with 18 carbon atoms of 1-18% by weight, and (D) water, wherein its average particle diameter is 110 nm or smaller. It is superior in acid resistance, salt-resistance and heat resistance, and further enables to maintain the good water-soluble state being blended to medicines, foods and beverages, cosmetics, feeds, additives usually employed therein.
摘要翻译： 一种水溶性组合物，其包含（A）5-40重量％的辅酶Q10，（B）平均聚合度为10的聚甘油单酯和5-30重量％的碳原子的脂肪酸，（C）单 - ，平均聚合度为3-6的聚甘油的二 - ，三 - 或五 - 酯，和18个碳原子的脂肪酸为1-18重量％，和（D）水，其平均粒径为110nm 或更小。 耐酸性，耐盐性和耐热性优异，并且还能够将通常使用的药物，食品和饮料，化妆品，饲料，添加剂中的添加剂保持良好的水溶性状态。
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6.发明授权公开(公告)号：US08392011B2
公开(公告)日：2013-03-05
申请号：US11476382
申请日：2006-06-28
申请人： Takeshi Segawa , Koichi Yamaguchi , Yuichi Iwakata
发明人： Takeshi Segawa , Koichi Yamaguchi , Yuichi Iwakata
CPC分类号： H01L21/67294
摘要： A semiconductor wafer processing tape sticking apparatus is provided and is capable of sticking a semiconductor wafer processing tape to a semiconductor wafer under the optimum conditions based on the processing data that has been written to a data carrier member and that has been read from the data carrier member without accessing the host computer unlike a conventional method. The semiconductor wafer processing tape sticking apparatus includes: a feeding apparatus provided with a feeding shaft to which a semiconductor wafer processing tape winding body can be detachably attached; a tape data read/write device for reading and writing the processing data that has been written to a data carrier member of the semiconductor wafer processing tape winding body; and a tape sticking apparatus for sticking a semiconductor wafer processing tape that has been fed out from the feeding apparatus to the semiconductor wafer based on the processing data that has been read by the tape data read/write device.
摘要翻译： 提供半导体晶片处理带贴附装置，并且能够在最佳条件下将半导体晶片处理带粘贴到半导体晶片处理带上，该条件基于已经写入数据载体成员并从数据载体读取的处理数据 不像常规方法那样访问主机。 半导体晶片处理带贴附装置包括：馈送装置，其具有可以可拆卸地安装半导体晶片加工带卷绕体的馈送轴; 用于读取和写入已经写入到半导体晶片处理带卷绕体的数据载体构件的处理数据的磁带数据读/写装置; 以及胶带粘贴装置，用于根据由磁带数据读/写装置读取的处理数据，将从馈送装置输出的半导体晶片处理带粘贴到半导体晶片。
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7.发明授权Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure 有权保持夹具，半导体晶片研磨方法，半导体晶片保护结构和半导体晶片研磨方法以及使用该结构的半导体芯片制造方法公开(公告)号：US08212345B2
公开(公告)日：2012-07-03
申请号：US12945078
申请日：2010-11-12
IPC分类号： H01L23/02
CPC分类号： H01L21/6875 , B24B37/042 , B24B41/061 , B65G49/061 , B65G2249/045 , Y10T428/24322
摘要： A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.
摘要翻译： 半导体晶片W的背面研磨机10包括：设置在安装件11的工作面上的工作台13; 通过表13上的检查台15布置多个保持夹具20; 用于进行通过保持夹具20保持的半导体晶片W的后侧的研磨处理的研磨机30; 以及用于接地半导体晶片W的洗涤装置40.每个保持夹具20由在基板21的表面上凹陷的凹部22构成，多个支撑突起23投影地排列在凹部22的底面上， 接触膜24，覆盖凹部22，由多个支撑突起23支撑，用于可拆卸地保持半导体晶片W与其紧密接触; 以及用于将空气从由接触膜24覆盖的凹部22引导到外部的排气路径25。
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公开(公告)号：US08182649B2
公开(公告)日：2012-05-22
申请号：US12445697
申请日：2007-10-12
IPC分类号： B32B38/10
CPC分类号： H01L21/6838 , H01L21/67132 , Y10S156/941 , Y10T156/1132 , Y10T156/1168 , Y10T156/1944 , Y10T156/1978
摘要： It is an object to provide a fixing jig which can unmovably suction a chip group produced by segmenting a semiconductor wafer into pieces, and can suction one chip by detaching the chip selectively and reliably from the chip group. A fixing jig 3 is composed of a jig base 30 and an contact layer 31. A concave part 2 is formed on one side of the jig base 30. The concave part 2 is sectioned into small chambers 15 by a partition 12 having a height almost equivalent to that of a sidewall 35. The contact layer 31 is disposed on the upper edge of the sidewall 35 and the partition 12 for covering the concave part 2. A through hole 17 that is communicated with the outside is formed in each small chamber 15.
摘要翻译： 本发明的目的是提供一种固定夹具，其可以将通过将半导体晶片分割成片而产生的芯片组不可移动地吸引，并且可以通过从芯片组中选择性且可靠地分离芯片来吸引一个芯片。 固定夹具3由夹具基座30和接触层31构成。凹部2形成在夹具基座30的一侧。凹部2由高度几乎为几厘米的隔板12分割成小室15 接触层31设置在侧壁35的上边缘和用于覆盖凹部2的隔壁12上。在每个小室15中形成有与外部连通的通孔17 。
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9.发明申请HOLDING JIG, SEMICONDUCTOR WAFER GRINDING METHOD, SEMICONDUCTOR WAFER PROTECTING STRUCTURE AND SEMICONDUCTOR WAFER GRINDING METHOD AND SEMICONDUCTOR CHIP FABRICATION METHOD USING THE STRUCTURE 有权控制晶圆，半导体晶粒磨削方法，半导体晶体保护结构和半导体晶粒研磨方法及半导体芯片制造方法公开(公告)号：US20110281509A1
公开(公告)日：2011-11-17
申请号：US12945078
申请日：2010-11-12
IPC分类号： H01L21/304 , B24B41/06
CPC分类号： H01L21/6875 , B24B37/042 , B24B41/061 , B65G49/061 , B65G2249/045 , Y10T428/24322
摘要： A backgrinding machine 10 of a semiconductor wafer W includes: a table 13 set on the working plane of a mount 11; a multiple number of holding jigs 20 arranged via check tables 15 on table 13; a grinding machine 30 for performing a grinding process of the rear side of semiconductor wafer W held by holding jig 20; and a washing device 40 for ground semiconductor wafers W. Each holding jig 20 is constructed of a concave 22 depressed on the surface of a base plate 21, a multiple number of supporting projections 23 projectively arrayed on the bottom surface of concave 22, a deformable contact film 24, covering the concave 22, being supported by the multiple supporting projections 23, for detachably holding semiconductor wafer W in close contact with it; and an exhaust path 25 for conducting air from the concave 22 covered by contact film 24 to the outside.
摘要翻译： 半导体晶片W的背面研磨机10包括：设置在安装件11的工作面上的工作台13; 通过表13上的检查台15布置多个保持夹具20; 用于进行通过保持夹具20保持的半导体晶片W的后侧的研磨处理的研磨机30; 以及用于接地半导体晶片W的洗涤装置40.每个保持夹具20由在基板21的表面上凹陷的凹部22构成，多个支撑突起23投影地排列在凹部22的底面上， 接触膜24，覆盖凹部22，由多个支撑突起23支撑，用于可拆卸地保持半导体晶片W与其紧密接触; 以及用于将空气从由接触膜24覆盖的凹部22引导到外部的排气路径25。
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公开(公告)号：US20100314894A1
公开(公告)日：2010-12-16
申请号：US12445697
申请日：2007-10-12
IPC分类号： H01L21/67 , B25J15/06 , B66C1/02 , F16M13/00 , H01L21/683
CPC分类号： H01L21/6838 , H01L21/67132 , Y10S156/941 , Y10T156/1132 , Y10T156/1168 , Y10T156/1944 , Y10T156/1978
摘要： It is an object to provide a fixing jig which can unmovably suction a chip group produced by segmenting a semiconductor wafer into pieces, and can suction one chip by detaching the chip selectively and reliably from the chip group. A fixing jig 3 is composed of a jig base 30 and an contact layer 31. A concave part 2 is formed on one side of the jig base 30. The concave part 2 is sectioned into small chambers 15 by a partition 12 having a height almost equivalent to that of a sidewall 35. The contact layer 31 is disposed on the upper edge of the sidewall 35 and the partition 12 for covering the concave part 2. A through hole 17 that is communicated with the outside is formed in each small chamber 15.
摘要翻译： 本发明的目的是提供一种固定夹具，其可以将通过将半导体晶片分割成片而产生的芯片组不可移动地吸引，并且可以通过从芯片组中选择性且可靠地分离芯片来吸引一个芯片。 固定夹具3由夹具基座30和接触层31构成。凹部2形成在夹具基座30的一侧。凹部2由高度几乎为几厘米的隔板12分割成小室15 接触层31设置在侧壁35的上边缘和用于覆盖凹部2的隔壁12上。在每个小室15中形成有与外部连通的通孔17 。
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