发明申请
US20070165328A1 Acoustic Damping Pad That Reduces Deflection of a Circuit Board 失效
减少电路板偏转的阻尼垫

Acoustic Damping Pad That Reduces Deflection of a Circuit Board
摘要:
A acoustic damping pad is provided. The acoustic damping pad includes a first surface and an opposing second surface that are defined by a periphery. A first set of perforations extend between the first surface and the second surface of the acoustic damping pad. Each adjacent perforation in the first set of perforations is uniformly spaced apart from each other across a first select surface area of the first surface and across a corresponding first select surface area of the opposing second surface to form a uniform pattern.
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