Stiffness reducing features in a top layer of a laminated top cover
    1.
    发明授权
    Stiffness reducing features in a top layer of a laminated top cover 有权
    层压顶盖顶层的刚度降低特征

    公开(公告)号:US07787212B2

    公开(公告)日:2010-08-31

    申请号:US11671685

    申请日:2007-02-06

    CPC classification number: G11B25/043 G11B33/1433

    Abstract: Stiffness reducing features for top covers of data storage systems are provided to prevent delaminating of top layers of the top covers. A top cover for a data storage system includes a bottom layer, a top layer and an adhesive layer that interconnects the top and bottom layers. At least one groove is formed in and extends along the top layer. The at least one groove reduces a thickness of the top layer along the at least one groove.

    Abstract translation: 提供数据存储系统顶盖的刚度降低功能,以防止顶盖顶层的分层。 用于数据存储系统的顶盖包括底层,顶层和互连顶层和底层的粘合剂层。 至少一个凹槽形成在顶层中并沿顶层延伸。 所述至少一个凹槽沿着所述至少一个凹槽减小所述顶层的厚度。

    Stiffness Reducing Features in a Top Layer of a Laminated Top Cover
    2.
    发明申请
    Stiffness Reducing Features in a Top Layer of a Laminated Top Cover 有权
    层压顶盖顶层的刚度降低特征

    公开(公告)号:US20070206322A1

    公开(公告)日:2007-09-06

    申请号:US11671685

    申请日:2007-02-06

    CPC classification number: G11B25/043 G11B33/1433

    Abstract: Stiffness reducing features for top covers of data storage systems are provided to prevent delaminating of top layers of the top covers. A top cover for a data storage system includes a bottom layer, a top layer and an adhesive layer that interconnects the top and bottom layers. At least one groove is formed in and extends along the top layer. The at least one groove reduces a thickness of the top layer along the at least one groove.

    Abstract translation: 提供数据存储系统顶盖的刚度降低功能,以防止顶盖顶层的分层。 用于数据存储系统的顶盖包括底层,顶层和互连顶层和底层的粘合剂层。 至少一个凹槽形成在顶层中并沿顶层延伸。 所述至少一个凹槽沿着所述至少一个凹槽减小所述顶层的厚度。

    Acoustic Damping Pad That Reduces Deflection of a Circuit Board
    3.
    发明申请
    Acoustic Damping Pad That Reduces Deflection of a Circuit Board 失效
    减少电路板偏转的阻尼垫

    公开(公告)号:US20070165328A1

    公开(公告)日:2007-07-19

    申请号:US11624420

    申请日:2007-01-18

    CPC classification number: G11B33/08 G11B25/043

    Abstract: A acoustic damping pad is provided. The acoustic damping pad includes a first surface and an opposing second surface that are defined by a periphery. A first set of perforations extend between the first surface and the second surface of the acoustic damping pad. Each adjacent perforation in the first set of perforations is uniformly spaced apart from each other across a first select surface area of the first surface and across a corresponding first select surface area of the opposing second surface to form a uniform pattern.

    Abstract translation: 提供声阻尼垫。 声阻尼垫包括由周边限定的第一表面和相对的第二表面。 第一组穿孔在声阻尼垫的第一表面和第二表面之间延伸。 第一组穿孔中的每个相邻的穿孔在第一表面的第一选择表面区域和第二选择表面区域相互间隔彼此均匀地间隔开并且相对的第二表面的相应的第一选择表面区域形成均匀的图案。

    Acoustic damping pad that reduces deflection of a circuit board
    4.
    发明授权
    Acoustic damping pad that reduces deflection of a circuit board 失效
    减震垫,减少电路板的挠曲

    公开(公告)号:US07742257B2

    公开(公告)日:2010-06-22

    申请号:US11624420

    申请日:2007-01-18

    CPC classification number: G11B33/08 G11B25/043

    Abstract: A acoustic damping pad is provided. The acoustic damping pad includes a first surface and an opposing second surface that are defined by a periphery. A first set of perforations extend between the first surface and the second surface of the acoustic damping pad. Each adjacent perforation in the first set of perforations is uniformly spaced apart from each other across a first select surface area of the first surface and across a corresponding first select surface area of the opposing second surface to form a uniform pattern.

    Abstract translation: 提供声阻尼垫。 声阻尼垫包括由周边限定的第一表面和相对的第二表面。 第一组穿孔在声阻尼垫的第一表面和第二表面之间延伸。 第一组穿孔中的每个相邻的穿孔在第一表面的第一选择表面区域和第二选择表面区域相互间隔彼此均匀地间隔开并且相对的第二表面的相应的第一选择表面区域形成均匀的图案。

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