Invention Application
- Patent Title: Paperboard substrate for blister packaging
- Patent Title (中): 用于泡罩包装的纸板基材
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Application No.: US11593462Application Date: 2006-11-06
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Publication No.: US20070166492A1Publication Date: 2007-07-19
- Inventor: Victor Holbert , David Reed
- Applicant: Victor Holbert , David Reed
- Main IPC: B32B27/08
- IPC: B32B27/08 ; B32B7/12 ; B32B27/40 ; B32B27/34 ; B32B27/36 ; B65D83/04
Abstract:
A packaging laminate comprising a paperboard substrate for providing a base layer, a tear-resistant polymer layer applied to said substrate, and a heat seal polymer layer applied to said tear-resistant polymer. This laminate structure is particularity useful for blister pack packaging.
Information query
