发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGE SYSTEM
- 专利标题（中）： 集成电路封装系统
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申请号： US11307128申请日： 2006-01-24
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公开(公告)号： US20070170559A1公开(公告)日： 2007-07-26
- 发明人: Zigmund Ramirez Camacho , Henry D. Bathan , Arnel Trasporto , Jeffrey D. Punzalan
- 申请人： Zigmund Ramirez Camacho , Henry D. Bathan , Arnel Trasporto , Jeffrey D. Punzalan
- 申请人地址： SG Singapore
- 专利权人： STATS CHIPPAC LTD.
- 当前专利权人： STATS CHIPPAC LTD.
- 当前专利权人地址： SG Singapore
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
An integrated circuit package system is provided forming a lead finger from a padless lead frame, forming a lead tip hole in the lead finger, mounting an integrated circuit die having a solder bump on the lead finger, and reflowing the solder bump on the lead tip hole of the lead finger.
公开/授权文献
- US08120149B2 Integrated circuit package system 公开/授权日：2012-02-21
信息查询
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