-
公开(公告)号：US08629537B2
公开(公告)日：2014-01-14
申请号：US11339176
申请日：2006-01-23
IPC分类号： H01L23/495
CPC分类号： H01L23/49503 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/29007 , H01L2224/32014 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83385 , H01L2224/83856 , H01L2924/00014 , H01L2924/01005 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/00012 , H01L2924/3512 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided forming a die support system from a padless lead frame having die supports with each substantially equally spaced from another, and attaching an integrated circuit die having a peripheral area on the die supports.
摘要翻译： 提供了一种集成电路封装系统，其从具有管芯支撑件的无衬垫引线框架形成管芯支撑系统，每个管芯支架各自与另一个基本上等间隔开，并且在管芯支撑件上附接具有周边区域的集成电路管芯。
-
公开(公告)号：US20070170559A1
公开(公告)日：2007-07-26
申请号：US11307128
申请日：2006-01-24
IPC分类号： H01L23/495
CPC分类号： H01L23/4951 , H01L23/49548 , H01L24/81 , H01L2224/16 , H01L2224/16237 , H01L2224/16245 , H01L2224/81136 , H01L2224/8114 , H01L2224/81385 , H01L2224/81801 , H01L2924/0105 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： An integrated circuit package system is provided forming a lead finger from a padless lead frame, forming a lead tip hole in the lead finger, mounting an integrated circuit die having a solder bump on the lead finger, and reflowing the solder bump on the lead tip hole of the lead finger.
摘要翻译： 提供一种集成电路封装系统，从无铅引线框架形成引线指，在引线指中形成引线尖端孔，将具有焊料凸点的集成电路芯片安装在引线指状物上，并将引线尖端上的焊料凸点回流 导针的孔。
-
公开(公告)号：US07977579B2
公开(公告)日：2011-07-12
申请号：US11278070
申请日：2006-03-30
IPC分类号： H05K1/16
CPC分类号： H05K1/183 , H01L23/13 , H01L23/3128 , H01L23/36 , H01L23/4334 , H01L23/49822 , H01L24/97 , H01L25/0657 , H01L25/50 , H01L2224/16 , H01L2224/16225 , H01L2224/97 , H01L2225/06517 , H01L2225/06589 , H01L2924/01033 , H01L2924/01082 , H01L2924/07802 , H01L2924/14 , H01L2924/15153 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H05K1/141 , H05K3/3436 , H05K2201/09845 , H05K2201/10515 , H05K2201/10674 , H05K2201/10689 , Y10T29/4913 , H01L2224/81 , H01L2224/83 , H01L2924/00
摘要： An integrated circuit package system includes forming a multi-tier substrate, and attaching a plurality of integrated circuits on the multi-tier substrate.
摘要翻译： 一种集成电路封装系统，包括形成多层衬底，以及在多层衬底上附着多个集成电路。
-
公开(公告)号：US07541221B2
公开(公告)日：2009-06-02
申请号：US11307386
申请日：2006-02-04
CPC分类号： H01L23/49548 , H01L23/49579 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/13099 , H01L2224/131 , H01L2224/16 , H01L2224/1601 , H01L2224/81141 , H01L2224/81192 , H01L2224/81193 , H01L2224/812 , H01L2224/81801 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15151
摘要： An integrated circuit package system including forming a leadframe having a lead with a leadfinger support of a predetermined height, and attaching an integrated circuit die with an electrical interconnect at a predetermined collapse height determined by the predetermined height of the leadfinger support.
摘要翻译： 一种集成电路封装系统，包括形成具有预定高度的引线支架的引线的引线框架，并且以由引导板支撑件的预定高度确定的预定的折叠高度将集成电路管芯与电互连件连接。
-
公开(公告)号：US07365417B2
公开(公告)日：2008-04-29
申请号：US11306693
申请日：2006-01-06
IPC分类号： H01L23/02
CPC分类号： H01L23/3107 , H01L23/49513 , H01L23/49548 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L2224/27013 , H01L2224/2919 , H01L2224/32014 , H01L2224/32057 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83051 , H01L2224/83101 , H01L2224/83194 , H01L2224/83385 , H01L2224/8385 , H01L2224/85 , H01L2924/00014 , H01L2924/01082 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system is provided attaching a film to a die paddle, applying an adhesive to the film, and attaching an integrated circuit die over the adhesive and the film to the die paddle.
摘要翻译： 提供了一种集成电路封装系统，其将膜连接到管芯焊盘，向膜施加粘合剂，以及将集成电路管芯粘合到粘合剂和膜上并附接到管芯焊盘。
-
公开(公告)号：US08633578B2
公开(公告)日：2014-01-21
申请号：US13196279
申请日：2011-08-02
IPC分类号： H01L23/02
CPC分类号： H01L23/3128 , H01L22/32 , H01L23/3135 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/03 , H01L2224/05553 , H01L2224/05554 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48225 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2225/06565 , H01L2924/00014 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/32145 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system with laminate base includes: a base package including: a laminate substrate strip, an integrated circuit on the laminate substrate strip, a molded cover over the integrated circuit and the laminate substrate strip, and a strip test of the base package; a bare die on the base package; the bare die electrically connected to the laminate substrate strip; and the bare die and the base package encapsulated.
摘要翻译： 一种具有层压基座的集成电路封装系统，包括：基座封装，包括：叠层基板条，叠层基板条上的集成电路，集成电路上的模制盖和叠层基板条，以及基板封装 ; 在基础包上裸露的裸片; 所述裸模与所述层叠基板条电连接; 并封装了裸芯片和基底封装。
-
公开(公告)号：US20080017960A1
公开(公告)日：2008-01-24
申请号：US11459325
申请日：2006-07-21
IPC分类号： H01L23/02
CPC分类号： H01L23/3128 , H01L22/32 , H01L23/3135 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/03 , H01L2224/05553 , H01L2224/05554 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48225 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2225/06565 , H01L2924/00014 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/32145 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system with laminate base is provided including forming a base package including, forming a laminate substrate strip, mounting an integrated circuit on the laminate substrate strip, forming a molded cover over the integrated circuit and the laminate substrate strip, and performing a strip test of the base package; attaching a bare die to the base package; connecting electrically the bare die to the laminate substrate strip; and encapsulating the bare die and the base package.
摘要翻译： 提供了一种具有层叠基底的集成电路封装系统，包括形成基底封装，包括形成层压衬底条，将集成电路安装在层叠衬底条上，在集成电路和叠层衬底条上形成模制盖， 基础包装的剥离试验; 将裸模附接到基底包装; 将裸模电连接到层压基板条上; 并封装裸芯片和基底封装。
-
公开(公告)号：US08120156B2
公开(公告)日：2012-02-21
申请号：US11307723
申请日：2006-02-17
IPC分类号： H01L23/02
CPC分类号： H01L25/03 , H01L24/73 , H01L25/0657 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73207 , H01L2224/73215 , H01L2224/73265 , H01L2225/0651 , H01L2225/0652 , H01L2225/06572 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention provides an integrated circuit package system with die on base package comprising forming a base package comprising, forming a substrate, mounting a first integrated circuit on the substrate, encapsulating the integrated circuit and the substrate with a molding compound, and testing the base package, attaching a bare die to the base package, connecting electrically the bare die to the substrate and encapsulating the bare die and the base package.
摘要翻译： 本发明提供了一种集成电路封装系统，其具有基底封装上的管芯，包括形成基底封装，其包括：形成衬底，将第一集成电路安装在衬底上，用模塑料封装集成电路和衬底，以及测试基底 封装，将裸芯片附接到基底封装，将裸裸片电连接到衬底并封装裸裸片和基底封装。
-
公开(公告)号：US08120149B2
公开(公告)日：2012-02-21
申请号：US11307128
申请日：2006-01-24
IPC分类号： H01L23/495 , H01L21/82
CPC分类号： H01L23/4951 , H01L23/49548 , H01L24/81 , H01L2224/16 , H01L2224/16237 , H01L2224/16245 , H01L2224/81136 , H01L2224/8114 , H01L2224/81385 , H01L2224/81801 , H01L2924/0105 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： An integrated circuit package system is provided forming a lead finger from a padless lead frame, forming a lead tip hole in the lead finger, mounting an integrated circuit die having a solder bump on the lead finger, and reflowing the solder bump on the lead tip hole of the lead finger.
摘要翻译： 提供一种集成电路封装系统，从无铅引线框架形成引线指，在引线指中形成引线尖端孔，将具有焊料凸点的集成电路芯片安装在引线指状物上，并将引线尖端上的焊料凸点回流 导针的孔。
-
公开(公告)号：US20110284842A1
公开(公告)日：2011-11-24
申请号：US13196279
申请日：2011-08-02
IPC分类号： H01L23/58
CPC分类号： H01L23/3128 , H01L22/32 , H01L23/3135 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/03 , H01L2224/05553 , H01L2224/05554 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48225 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2225/06565 , H01L2924/00014 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2224/32145 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package system with laminate base includes: a base package including: a laminate substrate strip, an integrated circuit on the laminate substrate strip, a molded cover over the integrated circuit and the laminate substrate strip, and a strip test of the base package; a bare die on the base package; the bare die electrically connected to the laminate substrate strip; and the bare die and the base package encapsulated.
摘要翻译： 一种具有层压基座的集成电路封装系统，包括：基座封装，包括：叠层基板条，叠层基板条上的集成电路，集成电路上的模制盖和叠层基板条，以及基板封装 ; 在基础包上裸露的裸片; 所述裸模与所述层叠基板条电连接; 并封装了裸芯片和基底封装。
-
-
-
-
-
-
-
-
-
搜索结果
81 条记录 (耗时 0.023 秒)
