发明申请
- 专利标题: Low Cost High Throughput Processing Platform
- 专利标题(中): 低成本高吞吐量处理平台
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申请号: US11622361申请日: 2007-01-11
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公开(公告)号: US20070175864A1公开(公告)日: 2007-08-02
- 发明人: Leszek Niewmierzycki , David Barker , Daniel Devine , Michael Kuhlman , Ryan Pakulski , Hongqing Shan , Martin Zucker
- 申请人: Leszek Niewmierzycki , David Barker , Daniel Devine , Michael Kuhlman , Ryan Pakulski , Hongqing Shan , Martin Zucker
- 主分类号: C03C15/00
- IPC分类号: C03C15/00 ; B44C1/22 ; H01L21/306
摘要:
As part of a system for processing workpieces, a workpiece support arrangement, separate from a process chamber arrangement supports at least two workpieces at least generally in a stacked relationship to form a workpiece column. A transfer arrangement transports at least two of the workpieces between the workpiece column and the process chamber arrangement by simultaneously moving the two workpieces at least generally along first and second transfer paths, respectively, that are defined between the workpiece column and the first and second process stations. The transfer arrangement can simultaneously move untreated and treated workpieces. Vertical motion swing arms and coaxial swing arms are described. A pair of spaced apart swing arms, the workpiece column and the processing stations can cooperatively define a pentagonal shape. Timing belt backlash elimination, a dual degree of freedom slot valve and low point chamber pumping, for removing chamber contaminants, are also described.
公开/授权文献
- US07563068B2 Low cost high throughput processing platform 公开/授权日:2009-07-21
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