公开(公告)号：US07658586B2

公开(公告)日：2010-02-09

申请号：US11097412

申请日：2005-04-01

申请人： Leszek Niewmierzycki ,  David Barker ,  Michael Kuhlman ,  Ryan Pakulski ,  Hongqing Shan ,  Martin Zucker

发明人： Leszek Niewmierzycki ,  David Barker ,  Michael Kuhlman ,  Ryan Pakulski ,  Hongqing Shan ,  Martin Zucker

IPC分类号： H01L21/67

CPC分类号： B65G15/12 ,  H01L21/67742 ,  H01L21/67766 ,  H01L21/68707 ,  Y10S414/135 ,  Y10S414/139

摘要： A wafer processing system and method in which a wafer, having a diameter, is movable between a loadlock and a processing chamber. A transfer chamber is arranged for selective pressure communication with the loadlock and the processing chamber. The transfer chamber having a configuration of lateral extents such that the wafer is movable through the transfer chamber between the loadlock and processing chamber along a wafer transfer path and the configuration of lateral extents causes the wafer, having the wafer diameter and moving along the wafer transfer path, to interfere with at least one of the loadlock and the processing chamber for any position along the wafer transfer path. The wafer includes a center and the wafer transfer path cab be defined by movement of the center through the transfer chamber. Swing arms are described that can independently move by different angles in opposing directions from a home position.

摘要翻译： 一种晶片处理系统和方法，其中具有直径的晶片可在负载锁和处理室之间移动。 传送室被布置成用于与装载锁和处理室的选择性压力连通。 传送室具有横向范围的构造，使得晶片可沿着晶片传送路径移动通过负载锁和处理室之间的传送室，并且横向范围的配置导致具有晶片直径并沿着晶片传送移动的晶片 路径，以便沿着晶片传送路径的任何位置干扰负载锁和处理室中的至少一个。 晶片包括中心，并且晶片传送路径驾驶室由中心通过传送室的运动限定。 描述了可以从起始位置以相反方向独立地移动不同角度的摆动臂。

公开(公告)号：US20060045664A1

公开(公告)日：2006-03-02

申请号：US10919582

申请日：2004-08-17

申请人： Leszek Niewmierzycki ,  David Barker ,  Daniel Devine ,  Michael Kuhlman ,  Ryan Pakulski ,  Hongqing Shan ,  Martin Zucker

发明人： Leszek Niewmierzycki ,  David Barker ,  Daniel Devine ,  Michael Kuhlman ,  Ryan Pakulski ,  Hongqing Shan ,  Martin Zucker

IPC分类号： H01L21/677

CPC分类号： B65G15/12 ,  H01L21/67742 ,  H01L21/67766 ,  H01L21/68707 ,  Y10S414/135 ,  Y10S414/139

摘要： As part of a system for processing workpieces, a workpiece support arrangement, separate from a process chamber arrangement supports at least two workpieces at least generally in a stacked relationship to form a workpiece column. A transfer arrangement transports at least two of the workpieces between the workpiece column and the process chamber arrangement by simultaneously moving the two workpieces at least generally along first and second transfer paths, respectively, that are defined between the workpiece column and the first and second process stations. The transfer arrangement can simultaneously move untreated and treated workpieces. Vertical motion swing arms and coaxial swing arms are described. A pair of spaced apart swing arms, the workpiece column and the processing stations can cooperatively define a pentagonal shape. Timing belt backlash elimination, a dual degree of freedom slot valve and low point chamber pumping, for removing chamber contaminants, are also described.

公开(公告)号：US08668422B2

公开(公告)日：2014-03-11

申请号：US10919582

申请日：2004-08-17

申请人： Leszek Niewmierzycki ,  David Barker ,  Daniel J. Devine ,  Michael Kuhlman ,  Ryan Pakulski ,  Hongqing Shan ,  Martin Zucker

发明人： Leszek Niewmierzycki ,  David Barker ,  Daniel J. Devine ,  Michael Kuhlman ,  Ryan Pakulski ,  Hongqing Shan ,  Martin Zucker

IPC分类号： H01L21/677

CPC分类号： B65G15/12 ,  H01L21/67742 ,  H01L21/67766 ,  H01L21/68707 ,  Y10S414/135 ,  Y10S414/139

摘要： As part of a system for processing workpieces, a workpiece support arrangement, separate from a process chamber arrangement supports at least two workpieces at least generally in a stacked relationship to form a workpiece column. A transfer arrangement transports at least two of the workpieces between the workpiece column and the process chamber arrangement by simultaneously moving the two workpieces at least generally along first and second transfer paths, respectively, that are defined between the workpiece column and the first and second process stations. The transfer arrangement can simultaneously move untreated and treated workpieces. Vertical motion swing arms and coaxial swing arms are described. A pair of spaced apart swing arms, the workpiece column and the processing stations can cooperatively define a pentagonal shape. Timing belt backlash elimination, a dual degree of freedom slot valve and low point chamber pumping, for removing chamber contaminants, are also described.

摘要翻译： 作为用于处理工件的系统的一部分，与处理室装置分离的工件支撑装置至少大体上以堆叠关系支撑至少两个工件以形成工件柱。 传送装置通过同时移动两个工件至少大致沿着分别在工件柱和第一和第二过程之间的第一和第二传送路径移动工件柱和处理室装置之间的至少两个工件 车站。 传送装置可以同时移动未经处理和处理的工件。 描述了垂直运动摆臂和同轴摆臂。 一对间隔开的摆臂，工件列和加工台可以协调地限定五边形形状。 还描述了同步带齿隙消除，双自由度槽阀和低点室泵送，用于去除室污染物。

公开(公告)号：US20070175864A1

公开(公告)日：2007-08-02

申请号：US11622361

申请日：2007-01-11

申请人： Leszek Niewmierzycki ,  David Barker ,  Daniel Devine ,  Michael Kuhlman ,  Ryan Pakulski ,  Hongqing Shan ,  Martin Zucker

发明人： Leszek Niewmierzycki ,  David Barker ,  Daniel Devine ,  Michael Kuhlman ,  Ryan Pakulski ,  Hongqing Shan ,  Martin Zucker

IPC分类号： C03C15/00 ,  B44C1/22 ,  H01L21/306

CPC分类号： B65G15/12 ,  H01L21/67742 ,  H01L21/67766 ,  H01L21/68707 ,  Y10S414/135 ,  Y10S414/139

摘要： As part of a system for processing workpieces, a workpiece support arrangement, separate from a process chamber arrangement supports at least two workpieces at least generally in a stacked relationship to form a workpiece column. A transfer arrangement transports at least two of the workpieces between the workpiece column and the process chamber arrangement by simultaneously moving the two workpieces at least generally along first and second transfer paths, respectively, that are defined between the workpiece column and the first and second process stations. The transfer arrangement can simultaneously move untreated and treated workpieces. Vertical motion swing arms and coaxial swing arms are described. A pair of spaced apart swing arms, the workpiece column and the processing stations can cooperatively define a pentagonal shape. Timing belt backlash elimination, a dual degree of freedom slot valve and low point chamber pumping, for removing chamber contaminants, are also described.

摘要翻译： 作为用于处理工件的系统的一部分，与处理室装置分离的工件支撑装置至少大体上以堆叠关系支撑至少两个工件以形成工件柱。 传送装置通过同时移动两个工件至少大致沿着分别在工件柱和第一和第二过程之间的第一和第二传送路径移动工件柱和处理室装置之间的至少两个工件 车站。 传送装置可以同时移动未经处理和处理的工件。 描述了垂直运动摆臂和同轴摆臂。 一对间隔开的摆臂，工件列和加工台可以协调地限定五边形形状。 还描述了同步带齿隙消除，双自由度槽阀和低点室泵送，用于去除室污染物。

公开(公告)号：US20060039781A1

公开(公告)日：2006-02-23

申请号：US11097412

申请日：2005-04-01

申请人： Leszek Niewmierzycki ,  David Barker ,  Michael Kuhlman ,  Ryan Pakulski ,  Hongqing Shan ,  Martin Zucker

发明人： Leszek Niewmierzycki ,  David Barker ,  Michael Kuhlman ,  Ryan Pakulski ,  Hongqing Shan ,  Martin Zucker

IPC分类号： H01L21/677

CPC分类号： B65G15/12 ,  H01L21/67742 ,  H01L21/67766 ,  H01L21/68707 ,  Y10S414/135 ,  Y10S414/139

摘要： A wafer processing system and method in which a wafer, having a diameter, is movable between a loadlock and a processing chamber. A transfer chamber is arranged for selective pressure communication with the loadlock and the processing chamber. The transfer chamber having a configuration of lateral extents such that the wafer is movable through the transfer chamber between the loadlock and processing chamber along a wafer transfer path and the configuration of lateral extents causes the wafer, having the wafer diameter and moving along the wafer transfer path, to interfere with at least one of the loadlock and the processing chamber for any position along the wafer transfer path. The wafer includes a center and the wafer transfer path cab be defined by movement of the center through the transfer chamber. Swing arms are described that can independently move by different angles in opposing directions from a home position.

摘要翻译： 一种晶片处理系统和方法，其中具有直径的晶片可在负载锁和处理室之间移动。 传送室被布置成用于与装载锁和处理室的选择性压力连通。 传送室具有横向范围的构造，使得晶片可沿着晶片传送路径移动通过负载锁和处理室之间的传送室，并且横向范围的配置导致具有晶片直径并沿着晶片传送移动的晶片 路径，以便沿着晶片传送路径的任何位置干扰负载锁和处理室中的至少一个。 晶片包括中心，并且晶片传送路径驾驶室由中心通过传送室的运动限定。 描述了可以从起始位置以相反方向独立地移动不同角度的摆动臂。

公开(公告)号：US20050205210A1

公开(公告)日：2005-09-22

申请号：US11030362

申请日：2005-01-05

申请人： Daniel Devine ,  Rene George ,  Ryan Pakulski ,  David Barker

发明人： Daniel Devine ,  Rene George ,  Ryan Pakulski ,  David Barker

IPC分类号： B65G49/07 ,  C03C25/68 ,  C23C16/00 ,  C23C16/455 ,  C23C16/54 ,  C23F1/00 ,  G03F7/42 ,  H01L21/00 ,  H01L21/677

CPC分类号： H01J37/32743 ,  C23C16/45557 ,  C23C16/54 ,  G03F7/427 ,  H01J37/32935 ,  H01L21/67017 ,  H01L21/67196 ,  H01L21/67748

摘要： Workpiece processing uses a transfer chamber in cooperation with a process chamber. The workpiece is to be heated to a treatment temperature, at a preheating pressure, and subsequently exposed to a plasma at a treatment pressure, which is less than the preheating pressure. The process chamber pressure does not exceed the preheating pressure, yet very rapid pressure increases can be induced in the process chamber in transitioning from the treatment pressure to the preheating pressure. The transfer chamber pressure can be maintained at the treatment pressure, the preheating pressure or raised to a selected pressure to backfill the process chamber to the preheating pressure. A backfill arrangement can selectively induce rapid pressure increases in the process chamber. A bypass arrangement provides selective pressure communication between the transfer and process chambers and can be used for backfilling the process chamber from the transfer chamber.

摘要翻译： 工件处理使用与处理室协作的传送室。 将工件在预热压力下加热至处理温度，随后在小于预热压力的处理压力下暴露于等离子体。 处理室压力不超过预热压力，但是在处理室中从处理压力转换到预热压力可以引起非常快速的压力增加。 传送室压力可以保持在处理压力，预热压力或升高到选定的压力，以将处理室回填至预热压力。 回填装置可以选择性地引起处理室中的快速压力增加。 旁路装置提供转移和处理室之间的选择性压力连通，并且可用于从传送室回填处理室。

公开(公告)号：US07563068B2

公开(公告)日：2009-07-21

申请号：US11622361

申请日：2007-01-11

申请人： Leszek Niewmierzycki ,  David Barker ,  Daniel J. Devine ,  Michael Kuhlman ,  Ryan Pakulski ,  Hongqing Shan ,  Martin Zucker

发明人： Leszek Niewmierzycki ,  David Barker ,  Daniel J. Devine ,  Michael Kuhlman ,  Ryan Pakulski ,  Hongqing Shan ,  Martin Zucker

IPC分类号： B65H1/00

CPC分类号： B65G15/12 ,  H01L21/67742 ,  H01L21/67766 ,  H01L21/68707 ,  Y10S414/135 ,  Y10S414/139

摘要： As part of a system for processing workpieces, a workpiece support arrangement, separate from a process chamber arrangement supports at least two workpieces at least generally in a stacked relationship to form a workpiece column. A transfer arrangement transports at least two of the workpieces between the workpiece column and the process chamber arrangement by simultaneously moving the two workpieces at least generally along first and second transfer paths, respectively, that are defined between the workpiece column and the first and second process stations. The transfer arrangement can simultaneously move untreated and treated workpieces. Vertical motion swing arms and coaxial swing arms are described. A pair of spaced apart swing arms, the workpiece column and the processing stations can cooperatively define a pentagonal shape. Timing belt backlash elimination, a dual degree of freedom slot valve and low point chamber pumping, for removing chamber contaminants, are also described.

摘要翻译： 作为用于处理工件的系统的一部分，与处理室装置分开的工件支撑装置至少大体上以堆叠的关系支撑至少两个工件以形成工件柱。 传送装置通过同时移动两个工件至少大致沿着分别在工件柱和第一和第二过程之间的第一和第二传送路径移动工件柱和处理室装置之间的至少两个工件 车站。 传送装置可以同时移动未经处理和处理的工件。 描述了垂直运动摆臂和同轴摆臂。 一对间隔开的摆臂，工件列和加工台可以协调地限定五边形形状。 还描述了同步带齿隙消除，双自由度槽阀和低点室泵送，用于去除室污染物。