发明申请
- 专利标题: Component mounting method and component mounting apparatus
- 专利标题(中): 部件安装方法和部件安装装置
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申请号: US11570183申请日: 2005-06-03
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公开(公告)号: US20070181644A1公开(公告)日: 2007-08-09
- 发明人: Yasuharu Ueno , Makoto Morikawa , Shuichi Hirata , Hironori Kobayashi , Satoshi Shida
- 申请人: Yasuharu Ueno , Makoto Morikawa , Shuichi Hirata , Hironori Kobayashi , Satoshi Shida
- 申请人地址: JP Osaka 571-8501
- 专利权人: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- 当前专利权人: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- 当前专利权人地址: JP Osaka 571-8501
- 优先权: JP2004/170288 20040608
- 国际申请: PCT/JP05/10218 WO 20050603
- 主分类号: A47J36/02
- IPC分类号: A47J36/02
摘要:
A method and an apparatus for mounting electronic components that enables precise mounting of electronic components, such as deformation-prone thin IC chips or fine-pitch and high-pin-count IC chips, on a substrate. Thin IC chips, which conventionally tend to lose flatness because of warping that occurs during production or deformation that occurs when picked up with a suction nozzle, are pressed against a substrate (4) with a preset load using a suction nozzle with a flat suction surface (11b) so as to correct deformation; the suction nozzle (11) is controlled to move up to make up for a decrease in the distance between the oppositely spaced IC chip and the substrate (4) that is caused by thermal expansion due to the heating for melting solder bumps (1a) on the electrodes; and the suction nozzle (11) is controlled to move down to mitigate the effect of a pulling-apart force applied to the molten parts as the thermally expanded parts cool down and contract.