发明申请
US20070187258A1 Method for electrochemically polishing a conductive material on a substrate 审中-公开
在基板上电化学研磨导电材料的方法

Method for electrochemically polishing a conductive material on a substrate
摘要:
Methods are provided for removing conductive materials from a substrate surface. In one aspect, a method includes providing a substrate comprising dielectric feature definitions formed between substrate field regions, a barrier material disposed in the feature definitions and on the substrate field regions, and a conductive material disposed on the barrier material, polishing the substrate to substantially remove a bulk portion of the conductive material with a direct current bias, and polishing the substrate to remove a residual portion of the conductive material with a pulse bias.
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