发明申请
US20070187258A1 Method for electrochemically polishing a conductive material on a substrate
审中-公开
在基板上电化学研磨导电材料的方法
- 专利标题: Method for electrochemically polishing a conductive material on a substrate
- 专利标题(中): 在基板上电化学研磨导电材料的方法
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申请号: US11355769申请日: 2006-02-15
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公开(公告)号: US20070187258A1公开(公告)日: 2007-08-16
- 发明人: Tianbao Du , Feng Liu , Alain Duboust , Wei-Yung Hsu , Liang-Yuh Chen
- 申请人: Tianbao Du , Feng Liu , Alain Duboust , Wei-Yung Hsu , Liang-Yuh Chen
- 主分类号: B23H5/00
- IPC分类号: B23H5/00
摘要:
Methods are provided for removing conductive materials from a substrate surface. In one aspect, a method includes providing a substrate comprising dielectric feature definitions formed between substrate field regions, a barrier material disposed in the feature definitions and on the substrate field regions, and a conductive material disposed on the barrier material, polishing the substrate to substantially remove a bulk portion of the conductive material with a direct current bias, and polishing the substrate to remove a residual portion of the conductive material with a pulse bias.
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