发明申请
- 专利标题: Light emitting device and method of fabricating the same
- 专利标题(中): 发光元件及其制造方法
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申请号: US10590325申请日: 2005-02-25
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公开(公告)号: US20070187712A1公开(公告)日: 2007-08-16
- 发明人: Masato Yamada , Masanobu Takahashi
- 申请人: Masato Yamada , Masanobu Takahashi
- 申请人地址: JP Tokyo 100-0005
- 专利权人: Shin-Etsu Handotai Co., Ltd.
- 当前专利权人: Shin-Etsu Handotai Co., Ltd.
- 当前专利权人地址: JP Tokyo 100-0005
- 优先权: JP2004-052360 20040226
- 国际申请: PCT/JP05/03133 WO 20050225
- 主分类号: H01L33/00
- IPC分类号: H01L33/00
摘要:
A composite growth-assisting substrate 10 is formed by epitaxially growing a separation-assisting compound semiconductor layer 10k composed of a non-GaAs III-V compound semiconductor single crystal, and then a sub-substrate 10e composed of a GaAs single crystal in this order, on a first main surface of a substrate bulk 10m composed of a GaAs single crystal. The sub-substrate portion 10e is then separated from the composite growth-assisting substrate 10, so as to be left as a residual substrate portion 1 on a second main surface of the main compound semiconductor layer 40, and a portion of the residual substrate portion 1 is cut off to thereby form a cut-off portion 1j having a bottom surface used as a light extraction surface. By this configuration, the light emitting device is provided as allowing effective use of the GaAs substrate, and increasing the light extraction efficiency.
公开/授权文献
- US07972892B2 Light emitting device and method of fabricating the same 公开/授权日:2011-07-05
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